Primary links

PEEC

Realtime Proximity Electronic Endpoint Characterization - extremely thin specimens

 

PEEC is a new, patent pending, characterization module for ASAP-1 IPS digital sample preparation system. PEEC improves sample preparation techniques, particularly at extremely thin remaining silicon thickness (RST).

PEEC offers several plotting and mapping modes that work in parallel with the ASAP-1 IPS, with the main polishing system acting as the Control Unit.

The Touchscreen on PEEC allows interactive parametric modeling of the Device under Test. 

 

Sample Preparation with the Lights On!

 

A key features that PEEC adds to ASAP-1 IPS, is the novel ability to characterize and act upon electronic thresholds obtained from topside circuitry.

This information is gathered REAL TIME, through the polishing media, using the actual polishing bit as the probe.
 
 

Knowing this information allows the user to make informed preparation decisions, to achieve exactly the required RST, over the specified die area.

PEEC adds to the Engineers' toolkit in the preparation of parts, for current and future, analytical requirements such as SIL.

 

 

>> Click Here for Brochure

Note: ASAP-1®   is a Registered Trademark.   Portions of the Technology are covered under US and related Worldwide patents - 6,630,369 ;  6,781,232 & 7,066,788. 3 more Patent Pending.

Click Additional Images to Enlarge


Product Highlights

  • Sample Preparation with the Lights On!
  • Through-silicon method
  • Uses device IV curves to measure threshold and breakdown characteristics 
  • DYNAMIC - Realtime charaterization through polishing media DURING preparation
  • Suits very thin substrate thicknesses, below measurement limits of other backside measurement methods
  • Additional Plot Mode shows Tool Path -- shows force or electrical properties
  • Oscilloscope Mode
  • Interactive Touchscreen OS

 


 

Characterization Module

6369.1

PEEC - Proximity Electrial Endpoint Characterization Module

Endpointing / Characterization Module -- Includes software and hardware upgrades including external control box and parametric source. Requires Endpoint 1 to have been pre-installed.

Bookmark and Share

Featured Product

ULTRAPOL FIBERLAB Module System

ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...

Company News

Introducing 'In-Situ' RST Measurement & Ultra-High Definition Targeting for Micro-electronic Sample Prep

November 28, 2017

Shown for the first time at ISTFA 2017 -- ULTRA TEC is pleased to introduce a major...

TEC Tip

Taking sample alignment to the next level, brings better polishing results

ULTRACOLLIMATOR allows for unequalled precision in sample parallelism alignment. This advanced LASER optical module is available for all of ULTRA TEC's key flat and slected area polishing products....