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ASAP-1 IPS
Digital Selected Area Preparation System
Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC has produced leading solutions for backside preparation since 1999. With over 300 ASAP-1 units installed in Semiconductor industry labs throughout the world, we are proud to introduce the ASAP-1® IPS.
ENABLING THE NEXT GENERATION OF FAILURE ANALYSIS
Ever since the inception of the ASAP-1 Project, ULTRA TEC’s goal has been to offer both user-friendly and sample-friendly tools. The ASAP-1® analog systems offer elegant, intuitive controls which have enabled all labs to achieve quality results for subsequent analysis with Photon emission microscopes, laser/ thermal stimulus microscopes and FIB’s. The user-friendly intutive nature of the analog units has been carried forward, and expanded with ASAP-1® IPS.
DIGITAL CONTROL...DONE RIGHT!
ASAP-1® IPS offers deep sub-micron control on X, Y and Z axes, making it 'hands-down' the most accurate system ever seen in the market.
MUCH MORE THAN A MILL
ASAP-1® IPS enhances the market-leading attributes of our legacy products with the latest digital technology. It is now possible to grind substrates thinner, polish flatter and de-process even more accurately. ASAP-1® IPS introduces a suite of features that automate many aspects of the process – from analyzing the part to be processed, to writing intuitive programmable recipes, to reading in-situ end-stop indicators that ensure each important sample is prepared correctly. The patented 'float down' polishing head design is retained offering the means for producing the quality of final polish demanded by customers for backside microscopy.
IMPROVED SYSTEM CONTROLS
A dedicated machine-vision monitor provides a realtime view of the part, overlaid with current system coordinates and parameter. Now you can see the part as it is being processed!
.A touchscreen interface, a physical joystick and encoders -- alongside a suite of intuitive software and hardware -- empowers the FA technician & engineering professional for the next generation of failure analysis.
>> Click for Specifications, Videos, etc.
Note: ASAP-1® is a Registered Trademark. Portions of the Technology are covered under US and related Worldwide patents - 6,630,369 ; 6,781,232 & 7,066,788
Click Additional Images to Enlarge
IPS real time monitor shows X, Y & Z Positions, speeds feeds & tool diameter
machine vision, laser scan, & illumination provide feedback of system parameters
Machine Vision shows X,Y,Z Posns, spindle & table speeds, tool center & diam.
High-res LASER scan of a die made with ASAP-1 IPS X-Y table
The Touchscreen offers a powerful user interface - enhanced by physical controls
Product Highlights
- Suits all sizes of die - package, wafer and board-level
- Real Time Video Monitor with system parameter
- Touchscreen control with physical joystick & controls
- Rigidized Table Assembly and closed-loop, high-torque, motor control enhances the machining of tough and hard materials
- X, Y and Z axes all have deep sub-micron accuracy
- Accurately decaps, then thins substrate and polishes
- Patented Floating Head provides a true polishing action -- yields polishing quality & high survivability
- Intuitive menus provide a powerful, easy to use, system
- USB Flash Drive interface for preparation recipe storage
- Short set-up and process times
- Accurate die-tilt adjustment ‘on the fly’
- Bench-top & Quiet in Operation
Equipment
| Order Code | Item | Description |
|---|---|---|
| 6760.1 | ASAP-1® IPS with optical Control |
DIGITAL Selected Area Preparation System, 100-240V, 50/60Hz. Includes: X-Y table, tool spindle drive with deep sub-micron micron Z-resolution, compound sine tilt-table, touchscreen programming unit, ULTRACOLLIMATOR optical alignment, integrated real-time machine vision, 6.5 inch lcd monitor, set of 2mm and 3mm tools. |
| 6760.2 |
ASAP-1® IPS |
DIGITAL Selected Area Preparation System, 100-240V, 50/60Hz. Includes: X-Y table, tool spindle drive with deep sub-micron micron Z-resolution,tilt-table, touchscreen programming unit, integrated real-time machine vision, 6.5 inch lcd monitor, set of 2mm and 3mm tools. |
| 6715.1 | High torque Motor (upgrade) |
3X Torque motor. Suits aggressive material requirements such as removal of thick heat-sinks, removal of metals. |
| 6389.1 | Force Feedback Module | System upgrade to add force feedback and Z-endpoint control software for preparing delicate samples and dice for exhibiting in-package curvature. |
