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ASAP-1 IPS

Digital Selected Area Preparation System

ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polish­ing of packaged wafer-level devices.

Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device centric’ – designed to meet the non-destructive, high yield and survivability needs of micro-electronic components.

IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides an unique ‘always-live’ image of the device, along with key navigational and process information.

The touch-off tool control provides Z-position at pre-defined locations and pressures – enabling package and die tilt to be corrected quickly and accurately. Tool height variations are automatically-calibrated.

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Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device centric’ – designed to meet the non-destructive, high yield and survivability needs of micro-electronic components.
IPS’ Touch Screen OS has been designed from the ground-up to control all aspects
of the sample preparation process. Advanced programming drives IPS’s deep
sub-micron axes of motion. The machine vision monitor provides an unique
‘always-live’ image of the device, along with key navigational and process
information.
The touch-off tool control provides Z-position at pre-defined locations and
pressures – enabling package and die tilt to be corrected quickly and
accurately. Tool height variations are automatically-calibrated.

Note: ASAP-1®   is a Registered Trademark.   Portions of the Technology are covered under US and related Worldwide patents - 6,630,369 ;  6,781,232 & 7,066,788. 3 more Patent Pending.

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Product Highlights

  • Suits all sizes of die - package, wafer and board-level

    • Realtime Video Monitor with system parameters

    • Touchscreen control with physical joystick & encoders

    • Full 100 x 100 mm Stage area

    • X, Y and Z axes all have deep sub-micron accuracy

    • Accurately decaps, thins substrate and polishes

    • Floating Head (patented) provides a true polishing action

    • Force-Feedback enhances delicacy

    • USB Flash Drive interface for saving recipes


Equipment

Order Code Item Description
6760.3 ASAP-1®  IPS DIGITAL Selected Area Preparation System, 100-240V, 50/60Hz. Includes: X-Y table, tool spindle drive with deep sub-micron micron Z-resolution, +/- 5 degree automated tilt-table, touchscreen programming unit, integrated real-time machine vision, min 7 inch lcd monitor, set of 2mm and 3mm tools.
6715.1 High torque Motor (upgrade)

3X Torque motor. Suits aggressive material requirements such as removal of thick heat-sinks, removal of metals.

 

3D Upgrade Modules

6394.1

Curvature Correction

Adds sample curvature definition   – Suits decapsulation, thinning, and polishing of packaged dice showing warpage or non-flat conditions. Independent X & Y Axis Correction, AUTOCURVE Mode.  Also adds Stage AUTOTILT function

6366.1

Thermal Relaxation Stage

Adds thermal relaxation capability for warped die. Peltier-based heating plate with 1C accuracy. Hot Plate mode for convenient sample mount/demount. Includes stage, cable, two custom mounting plates with nylon retention screws

6686.1 Heat & Cool Thermal Relaxation and Stability Upgrade Adds thermal relaxation capability for warped die. Peltier-based heating plate with 1C accuracy. Hot Plate mode for convenient sample mount/demount. Includes stage, cable, two custom mounting plates with nylon retention screws -- as 6366.1 but adds Chiller unit and software to allow for faster cooling and overall enhanced system thermal stability

 

Characterization Modules

6368.1

End-Point Module

High impedance / small capacitance based -- Hardware and Software Upgrade to add end-pointing for enhancement of decap and de-processing

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