Every lab can now produce accurate, reproducible pre-cavitated devices -- ready for final decapsulation with RAPIDETCH, other chemical decapsulators, or PLASER plasma decapsulation system
Flip-chip and power chip mechanical pre-decapsulation is now straightforward and accurate.
BLUE MILL brings...
The RAPIDETCH Chemical IC Decapsulator series has been designed form the ground-up to meet the Industry's past, current and future product needs for ic decapsulation, counterfeit protection and packages containing - copper decapsulation, aluminum decapsulation, gold decapsulation...
Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and accurate. ASAP-1® DECAP brings cost-effective, bench-top advanced decapsulation and...
The FA-2000-P offers decapsulation and depassivation of packaged devices in an anisotropic manner for the worldwide Semiconductor industry.
Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-...
A Series of Banner Ads that run in MICROSCOPY TODAY magazine and related microscopy journals. The Ads highlight ULTRA TEC's products and commitment to advanced materials and microscopy through metallography,...
