SESAME 500 Laser Ablation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.
At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full protection from LASER...
The FA-2000-P offers decapsulation and depassivation of packaged devices in an anisotropic manner for the worldwide Semiconductor industry.
Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-...
SESAME PLASER Laser + Plasma Decapsulation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.
At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full...
SESAME 1000 Laser Ablation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.
At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full protection from LASER...
Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and accurate. ASAP-1® DECAP brings cost-effective, bench-top advanced decapsulation and...
Key growth areas in semiconductor packaging call for devices where 'small is everything' -- for applications such as handheld computers, counterfeit protection, smartphones, tablets, UMPC's, music players, ipods, and GPS devices. The RAPIDETCH Series of Chemical Decapsulators has been...
ICis is an advanced modular microscope offering up to 3 standard imaging modes -- NIR for Backside Imaging, UV for highest resolution, and Megapixel Color Imaging for topside parallel polishing. The...
ARC-lite provides a rapid, easy-to-apply and effective coating for improving backside imaging on thinned and polished semiconductor substrates. By applying a few drops of ARC-lite Imaging fluid and a short 45 second...
