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Selected Area Preparation

Selected Area Preparation

ASAP-1 IPS

  >> Get NEW Product Catalog Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to...

PEEC

  PEEC is a new, patent pending, characterization module for ASAP-1 IPS digital sample preparation system. PEEC improves sample preparation techniques, particularly at extremely thin remaining silicon thickness (RST). PEEC offers several plotting and mapping modes that work in...

ASAP-1 Basic

Note: Legacy Product Information - A newer version of this product is available. Click here Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and...

ASAP-1 IPS - Resources

          >> Download System PDF Datasheet   System Introduction - 'The Benefits of Going Digital'   Plastic Package Tilt Alignment on ASAP-1 IPS   Thermal Relaxation of IC Packages     Setting X-Y SAP Parameters with Target -- Scan...

ASAP-1

6360.1S ASAP-1 System with optical alignment
Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation. In recent years,...
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Featured Product

ULTRAPOL FIBERLAB Module System

ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...

Company News

Introducing 'In-Situ' RST Measurement & Ultra-High Definition Targeting for Micro-electronic Sample Prep

November 28, 2017

Shown for the first time at ISTFA 2017 -- ULTRA TEC is pleased to introduce a major...

TEC Tip

Air Polishing - A Key to successful connector polishing

Epoxy-bead removal is essential to contamination-free polishing. Epoxy can be removed more easily with specific grades of silicon-carbide lapping...