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Selected Area Preparation

Selected Area Preparation

Blue Mill

Every lab can now produce accurate, reproducible pre-cavitated devices -- ready for final decapsulation with RAPIDETCH, other chemical decapsulators, or plasma decapsulation systems. Chip-off. Flip-chip and power chip mechanical pre-decapsulation is now straightforward and accurate.  In...

ASAP-1 IPS

  >> Get NEW Product Catalog Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to...

RAPIDETCH

The RAPIDETCH Chemical IC Decapsulator series has been designed form the ground-up to meet the Industry's past, current and future product needs for ic decapsulation, counterfeit protection and packages containing - copper decapsulation, aluminum decapsulation, gold decapsulation...

PEEC

  PEEC is a new, patent pending, characterization module for ASAP-1 IPS digital sample preparation system. PEEC improves sample preparation techniques, particularly at extremely thin remaining silicon thickness (RST). PEEC offers several plotting and mapping modes that work in...

ASAP-1 Basic

Note: Legacy Product Information - A newer version of this product is available. Click here Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and...

ASAP-1 IPS - Resources

          >> Download System PDF Datasheet   System Introduction - 'The Benefits of Going Digital'   Plastic Package Tilt Alignment on ASAP-1 IPS   Thermal Relaxation of IC Packages     Setting X-Y SAP Parameters with Target -- Scan...

ASAP-1

6360.1S ASAP-1 System with optical alignment
Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation. In recent years,...
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Featured Product

Chip-Off Equipment for Digital Forensics

ULTRA TEC offers Cold Chip-off Equipment for Digital Forensics applications. See a video intro to our THIN BLUE (product)Line by visiting here.

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TEC Tip

Air Polishing - A Key to successful connector polishing

Epoxy-bead removal is essential to contamination-free polishing. Epoxy can be removed more easily with specific grades of silicon-carbide lapping...