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Selected Area Preparation

Selected Area Preparation

ASAP-1 IN SITU

ASAP-1 IN SITU
Based on a huge amount of customer input, we have delivered a single-footprint system that incorporates an RST Measurement System --allowing measurement of the thickness of remaining silicon without sample transfer.    ASAP-1 IN SITU includes an entirely new OS, driven by a large...

ASAP-1 IPS

ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polish­ing of packaged wafer-level devices. Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device centric’ –...

PEEC

  PEEC is a new, patent pending, characterization module for ASAP-1 IPS digital sample preparation system. PEEC improves sample preparation techniques, particularly at extremely thin remaining silicon thickness (RST). PEEC offers several plotting and mapping modes that work in...

ASAP-1 Basic

Note: Legacy Product Information - A newer version of this product is available. Click here Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and...

ASAP-1 IPS - Resources

          >> Download System PDF Datasheet   System Introduction - 'The Benefits of Going Digital'   Plastic Package Tilt Alignment on ASAP-1 IPS   Thermal Relaxation of IC Packages     Setting X-Y SAP Parameters with Target -- Scan...

ASAP-1

6360.1S ASAP-1 System with optical alignment
Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation. In recent years,...
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Featured Product

ULTRAPOL FIBERLAB Module System

ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...

Company News

ISTFA 2018 - Color Images - First Place Winner

November 12, 2018 - ULTRA TEC (Santa Ana, CA) are pleased to announce that 1st Place in the Color Images Category at ISTFA 2018 Photo Competition was won by Tim...

TEC Tip

Taking sample alignment to the next level, brings better polishing results

ULTRACOLLIMATOR allows for unequalled precision in sample parallelism alignment. This advanced LASER optical module is available for all of ULTRA TEC's key flat and slected area polishing products....