Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-corrosive gas and uses mass flow controllers with precise gas mixing. This is important to achieve selectivity and other issues and other issues...
Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC...
Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation.
In recent years,...
Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and accurate. ASAP-1® DECAP brings cost-effective, bench-top advanced decapsulation and...
Key growth areas in semiconductor packaging call for devices where 'small is everything' -- for applications such as handheld computers, counterfeit protection, smartphones, tablets, UMPC's, music players, ipods, and GPS devices. The RAPIDETCH Series of Chemical Decapsulators has been...
ICis is an advanced modular microscope offering up to 3 standard imaging modes -- NIR for Backside Imaging, UV for highest resolution, and Megapixel Color Imaging for topside parallel polishing. The...
The Hotplate Transfer Device holds the sample holder during sample mounting / demounting and allows for rapid transfer when hot. No need for tongs! Click for more
