Primary links

Chip-Off for Digital Forensics

 

The gathering and maintenance of data evidence is the overriding requirement for law enforcement professionals engaged in Digital Forensics. Mobile devices provide information (texts, emails, phone calls, GPS etc.) relative to a suspect's whereabouts and communications provide important evidence for an investigation.

Chip-Off is an important technique for digital forensics labs that need to access data from mobile devices, such as cellphones and tablets by matter subtraction. Older thermal techniques, using a heat-gun and a tweezer, have low yields and can lead to an unacceptable loss of data. ULTRA TEC has developed a range of mechanical machinery (precision sawing, milling and flat grinding) that keep process temperatures low and can prepare NAND Flash devices from all directions -- leading to consistency between users, and the highest yield -- with maintenance of crucial data after matter subtraction.

WHICH CHIP-OFF SYSTEMS ARE RIGHT FOR MY LAB?

ULTRA TEC is pleased to offer you cost-effective sample prep equipment with the minimum requirements for spare parts and ongoing maintenance – no nasty pricing ‘surprises’ down the road!

Dubbed the "Thin Blue (product) Line" we offer the following Chip-off solutions...

 

The Thin Blue (product) Line

 

System Name

Main Features
ULTRAPOL Basic Manual Chip-Off Machine Low Cost, cold chip-off solution, Already in use in crime labs throughout the world
ULTRAPOL Basic System Package Includes the LONG ARM Positioner for further increased yield and ease of use
BLUE MILL

Manual Milling system that uses uses small diamond and milling tools to pick out just the area of interest. Quickly removes PCB materials with no heat rise.

Cavity size is mechanically set -- no need for G-Code or computer programming.

ULTRASLICE Macrotome 

Safely sections (up to) whole cellphones and boards to gain access to the internal PCB's and NAND flash chips. 

After the MACROTOME operation, the part is transferred for further processing with ULTRAPOL or BLUE MILL Machines

 

For Further Reading: 

"Seeking the Truth from Mobile Evidence" by John Bair, 1st Edition. Chapter 27

"SWGDE Tech Notes regarding Chip-off via Material Removal Using a Lap and Polish Process"; Scientific Working Group on Digital Evidence ( https://www.swgde.org/ ); Published Feb, 2017

 

For even higher accuracy milling and polishing accuracy, we offer the industry-leading ASAP-1 Selected Area Preparation Systems.

WHICH MILLING SYSTEM IS RIGHT FOR MY LAB?

 

BLUE MILL

ASAP-1 ASAP-1 IPS
 

  
Control System Analog Analog Digital
Bench-top YES YES YES
Standard Z-Accuracy 10 microns 1 micron 0.04 microns
Standard X&Y Accuracy 10 microns 10 microns 0.2 microns
X&Y Max. Amplitude 18 mm 25mm or 50mm (option) 100 mm
High Torque Motor Upgrade YES YES YES
ULTRACOLLIMATOR Upgrade NO YES YES
Machine Vision YES - low mag option YES - low mag option YES - medium mag - monitor upgrade available
Patented Floating Head NO - direct Z position set YES YES - further enhanced with force-feedback software
Touch-off Mechanism

NONE 

Mechanical Gauge (offline) Force Sensor (online)
Programmable? NO NO YES
Tilt Table? YES - optional manual YES - manual YES - Manual or Automated
Table Illumination Method Optional LED's Optional incandescent lamp

In situ LED's

Vacuum Material Removal NO NO System Option
Curvature Correction Module (upgrade) NO NO YES
Thermal Relaxation Stage (upgrade) NO NO YES
Electrical End-point Upgrades NO NO YES
Price Low Low - Medium Medium - high

 

 

Bookmark and Share

Featured Product

ULTRAPOL FIBERLAB Module System

ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...

Company News

Introducing 'In-Situ' RST Measurement & Ultra-High Definition Targeting for Micro-electronic Sample Prep

November 28, 2017

Shown for the first time at ISTFA 2017 -- ULTRA TEC is pleased to introduce a major...

TEC Tip

Air Polishing - A Key to successful connector polishing

Epoxy-bead removal is essential to contamination-free polishing. Epoxy can be removed more easily with specific grades of silicon-carbide lapping...