The ULTRA TEC Cleaving Tool provides the fiber user with high quality, low damage cleaved surfaces for subsequent termination processes, whether polishing or splicing. It also works effectively for rapid scribe (& break) applciations on silicon wafers. 

 The unit is designed to be used like a pen and can be stored just as easily between uses.

Using a specially in-house angled and ground sapphire tip, the ULTRA TEC cleaving tool provides comparable results with other solutions costing many times more than this sub $100 unit.