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3D SAP offers 'Real World' Package Sample Preparation Solutions -- only on ASAP-1 IPS
Whether your chips are 'straight as a die' or 'seriously warped', methods exist to process them with ASAP-1 IPS from ULTRA TEC. Programmable Curvature, special PATENT PENDING processing techniques and...
See us @ ISTFA 2011 in San Jose
You are invited to visit our Booth (# 107) at the ISTFA 2011 Conference and Exhibition being held Nov 15-16, 2011, at the McEnery Convention Center, in San Jose, CA.
To register for a free...
Visit ULTRA TEC's YouTube Channel
Please visit our YOU TUBE Channel for a selection of product and application demonstrations....
ISTFA WRAP! - Dallas, TX, Nov 16-17, 2010
Thank you to all the visitor to our booth last month! It was a great event this year. ULTRA TEC personnel were on hand to demonstrate our FA product line, including the ASAP-1 range, ULTRAPOL...
LASER CHIP ACCESS - PRESENTATION - SEPT 9th, San Jose, CA
The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results -- especially on plastic packages. The LASER technique...
New Ads Light up the Optical Spectrum
A new ad series is currently running in Lightwave Magazine, highlighting ULTRA TEC's leading products for portable fiber polishing and fiber lensing. For more information, read the...
A New Website
Returning visitors to this URL will have noticed a sizable and, we hope, a welcome change to the site design of www.ultratecusa.com. The new site...
Register for a Free Mousepad
Available for a limited time with the launch of our new web-site! Please fill out out your full contact details to be added to our technical...
