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enabling FAILURE ANALYSIS Newsletter

November 2015 -- Read the latest copy of our Surface & Sample Prep Products Newsletter for the microelectronics and related market sectors.

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50th Anniversary Ad for Technical Journals

October 1, 2015 (Santa Ana, CA) -- This year ULTRA TEC Manufacturing, Inc. celebrates 50 years of business. Over this time we've seen the birth and growth of a...

New ULTRASLICE Precision Saw Brochure Available

March 2015 --  A new ULTRASLICE Brochure is Available. Contact us to request a hard copy -- or download here.

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EDFA Guest Editorial Provides Talking Points for New Generations of Sample Preparation Tools

December 2014 - Packages Have Become the New IC's -- EDFA Magazine Guest Editorial by Jim Colvin

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enabling FAILURE ANALYSIS Newsletter -- New Edition Published

October 28, 2014 -  ULTRA TEC MFg., Inc. has published its latest semiconductor FA-related newsletter. The latest edition features news and video segments related the improved ...

50 Year Anniversary Badge announced

Santa Ana, California, July 25, 2014 -- ULTRA TEC Manufacturing, Inc. announces a new company emblem in preparation for our upcoming 50th Anniversary. '50 Years of ULTRA TEC' branding will be featured on...

PEEC Endpoint Characterization Introduced @ ISTFA 2013

November 5, 2013 -- San Jose, CA -- ULTRA TEC Manufacturing, Inc. (Santa Ana, CA) announces the availability of a new technology, PEEC, for use with its popular ASAP-1 IPS Digital Preparation System...

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Featured Product

ULTRAPOL FIBERLAB Module System

ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...

TEC Tip

Easy sample transfer to and from the Hotplate

The Hotplate Transfer Device holds the sample holder during sample mounting / demounting and allows for rapid transfer when hot. No need for tongs! Click for more