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Electro-optics

Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies. ULTRA TEC has given particular attention to supplying products that span the wide application range, from systems for preparing lithium niobate, indium phosphide etc, prisms, waveguides, nanotechnology, and devices to supplying advanced flat lapping and precision sawing equipment for back lapping (back grinding).

Our Product Solutions include:

MICROSLICE and ULTRASLICE Precision Saws

ULTRAPOL Advance for flat lapping of small devices

MULTIPOL systems for up to 4" diameter components

 

Industry Literature

 
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Featured Product

Chip-Off Equipment for Digital Forensics

ULTRA TEC offers Cold Chip-off Equipment for Digital Forensics applications. See a video intro to our THIN BLUE (product)Line by visiting here.

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TEC Tip

Air Polishing - A Key to successful connector polishing

Epoxy-bead removal is essential to contamination-free polishing. Epoxy can be removed more easily with specific grades of silicon-carbide lapping...