Every lab can now produce accurate, reproducible, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decap. is now straightforward and accurate.
Thinned and polished die in a PQFP package, backside imaged using an Emission Microscope with NIR Illumination, with 20X objective.
The die, whether in packaged or wafer form, is mounted on a specially designed traveling table oscillates in the X and Y directions
A rotating tool, controlled in the Z-Direction, means reproducible grinding can be carried out to a specific thickness (routinely to less than 50mm of remaining silicon), finishing with a scratch-free mirror polish. This yields a surface ready for NIR imaging and backside analysis.
By changing tools, in conjunction with loose or fixed abrasives, a scratch-free surface is produced. Heating of the substrate is minimal during processing due to the low damage nature of the process.
>> Click here for Selected Area Preparation Product Brochure( PDF)
>>Click here for more about ASAP-1 Optical Upgrade
>> Find out more about ARC-lite AR coating system
Product highlights
Package
and wafer-level - all
sizes of die
Mechanical Decapsulation (on S-CSP, BGA, flip chip, power device, MCM package
styles and most other styles)
Low damage method allows for extremely thin samples
Accurately decaps,
then thins substrate and polishes
Intuitive
and easy to use.
Short set-up and
process times
Easy ‘Die tilt'
adjustment, during
the process
Bench-top and quiet.
Please call us ASAP to find out more details...
Emission site (yellow) shown by forward bias through an input pin, imaged with backside illumination with 20x objective
