ENHANCING THE PARALLELISM PERFORMANCE OF POLISHING MACHINERY

ULTRACOLLIMATOR modules provide the ability for producing extremely parallel surfaces on our range polishing products.

The system allows for sub-micron parallelism to be attained on the topside of an electronic die being de-processed or backside polished, or for use in aligning the sides of a wafer being processed, to be parallel.

System Specifications

>> Patent Pending

>> See Schematic of ULTRACOLLIMATOR Modes of Use

>> Download ULTRACOLLIMATOR Datasheet

>> Download TEC Note# 6 - "Improved de-processing of multi-layer electronic devices with optical alignment techniques" 

Image above shows the 6183.M showing the reflected image of the wafer's backside surface

Image above shows the 6183.A module incorporated into the ASAP-1 The module also operates as a machine-vision module.

Image above shows the 6183.U module in position on ULTRAPOL advance.