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Extended Range of Tools for ASAP-1 Sample Preparation Products

March 16, 2016 - (Santa Ana, CA)  

ULTRA TEC Manufacturing, Inc. is pleased to introduce a new extended range of tools for its popular ASAP-1 Selected Area Preparation Product line, including both 8mm and 12mm diameter diamond tools for processing large dice and substrate surfaces. The move to a ‘one-piece’ design improves both concentricity and product consistency. Tools are available for the processing of the full range of ic devices --  from surface mount packages of less than 0.5mm square, up to the largest programmable memory devices and server chips.

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