Primary links

Ultra Tec

Inert Nitrogen Etch Chamber

Offers low oxidation conditions for chemical etching

The RAPIDETCH Inert Nitrogen Etch Chamber is quickly mounted and demounted from the etching system. It is used when the package being etched required the lowest oxidizing conditions. The Etch Chamber includes a pressure-controllable plunger mechanism which replaces RAPIDETCH's arm mechanism. This ensures a controlled environment around the part being processed.

Product Highlights

  • Achieve low oxidation conditions - to avoid corrosion of bond wires etc. during acid etch on copper and similar materials 
  • Used with a nitrogen feed
  • Easy to mount and de-mount when required

 

ORDER CODE DESCRIPTION
8477.1 Inert Nitrogen Etch Chamber for RAPIDETCH

Related Products

Bookmark and Share

Featured Product

Polishing Matters!

A Series of Banner Ads that run in MICROSCOPY TODAY magazine and related microscopy journals. The Ads highlight ULTRA TEC's products and commitment to advanced materials and microscopy through metallography,...

Company News

Counterfeit IC Prevention with RAPIDETCH

ULTRA TEC is pleased to make available a new marketing flyer to promote methods for the prevention of Counterfeit Devices on the Global Supply Chain, using our popular ...

TEC Tip

Antireflective coating offers optimized backside imaging

ARC-lite provides a rapid, easy-to-apply and effective coating for improving backside imaging on thinned and polished semiconductor substrates. By applying a few drops of ARC-lite Imaging fluid and a short 45 second...