Primary links

Congratulations to the Authors of the ISTFA 2012 Best and Outstanding Papers!

Santa Ana, CA (Jan 15th, 2013) ULTRA TEC Manufacturing, Inc.,  joins the Electronic Device Failure Analysis Society -- EDFAS ( ) in congratulating the recipients of the Best Paper Awards @ ISTFA 2012.


Congratulations to the authors of the ISTFA 2012 Best and Outstanding Papers!  

Best Paper: 

FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices

-- Mr. Jim Colvin, FA Instruments, San Jose, CA

Outstanding Paper:

Advanced Physical Analysis Methodologies for Yield and Reliability of 28-nm, Bulk-Si, Flip-Chip ICs using SEM and Backside Deprocessing

--  Dr. Yuanjing (Jane) Li, Steven Scott and Howard Lee Marks, Silicon Failure Analysis Lab, nVIDIA Corporation, Santa Clara, CA


Bookmark and Share

Featured Product


ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...


Antireflective coating offers optimized backside imaging

ARC-lite provides a rapid, easy-to-apply and effective coating for improving backside imaging on thinned and polished semiconductor substrates. By applying a few drops of ARC-lite Imaging fluid and a short 45 second...