Primary links

Congratulations to the Authors of the ISTFA 2012 Best and Outstanding Papers!

Santa Ana, CA (Jan 15th, 2013) ULTRA TEC Manufacturing, Inc.,  joins the Electronic Device Failure Analysis Society -- EDFAS ( www.edfas.org ) in congratulating the recipients of the Best Paper Awards @ ISTFA 2012.

----------------

Congratulations to the authors of the ISTFA 2012 Best and Outstanding Papers!  

Best Paper: 

FemtoFarad/TeraOhm Endpoint Detection for Microsurgery of Integrated Circuit Devices

-- Mr. Jim Colvin, FA Instruments, San Jose, CA

Outstanding Paper:

Advanced Physical Analysis Methodologies for Yield and Reliability of 28-nm, Bulk-Si, Flip-Chip ICs using SEM and Backside Deprocessing

--  Dr. Yuanjing (Jane) Li, Steven Scott and Howard Lee Marks, Silicon Failure Analysis Lab, nVIDIA Corporation, Santa Clara, CA

 

Bookmark and Share

Featured Product

ULTRAPOL FIBERLAB Module System

ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...

Company News

ISTFA 2018 - Color Images - First Place Winner

November 12, 2018 - ULTRA TEC (Santa Ana, CA) are pleased to announce that 1st Place in the Color Images Category at ISTFA 2018 Photo Competition was won by Tim...

TEC Tip

Taking sample alignment to the next level, brings better polishing results

ULTRACOLLIMATOR allows for unequalled precision in sample parallelism alignment. This advanced LASER optical module is available for all of ULTRA TEC's key flat and slected area polishing products....