The use of LASER systems for electronic chip access is becoming a well established technique. The method has been proven to be fast and can gain valuable results -- especially on plastic packages. The LASER technique allows for ultra low temperature wet chemical final decapsulation and for reduced time with dry chemical (plasma) final decapsulation. The technique can be seen as a “Swiss knife” in many labs and many openings start with a LASER step today. This presentation also reviewed several case studies . 

About the Presenter:

Frederic Beauquis comes from France with a background in Electronics and Mechatronics from the University of Savoy in France. He worked with Süss Microtec as a probing measurement specialist for 6 years. Currently Fred is with Digit Concept as an application specialist. He is in charge of the LASER chip access and deals every day with new sample preparation techniques. He has made contributions to the topic of LASER access at ESREF 2009 and ANADEF 2010.

Presented by EDFAS - Golden Gate Chapter -  The Golden Gate Chapter of EDFAS (Electronic Device Failure Analysis Society). Sposorship of the event was provided by FA INSTRUMENTS

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