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LASER plus PLASMA Decapsulation = SESAME 2000

SESAME 2000: A novel design for decapsulation with Plasma using BSET EQ's FillerBlast™ technology has been integrated into the SESAME 1000 This allows final decapsulation, down to the die surface, without the use of acid. Click for more details

Polishing Matters!

A Series of Banner Ads that run in MICROSCOPY TODAY magazine and related microscopy journals. The Ads highlight ULTRA TEC's products and commitment to advanced materials and microscopy through metallography,...

Company News

Counterfeit IC Prevention with RAPIDETCH

ULTRA TEC is pleased to make available a new marketing flyer to promote methods for the prevention of Counterfeit Devices on the Global Supply Chain, using our popular ...

TEC Tip

Taking sample alignment to the next level, brings better polishing results

ULTRACOLLIMATOR allows for unequalled precision in sample parallelism alignment. This advanced LASER optical module is available for all of ULTRA TEC's key flat and slected area polishing products....