- Home
- Company
- Applications
- Equipment
- Consumables
- Contact Us
PLASER
Plasma Final Decapsulation Unit for Plastic IC Packages
PLASER offers final decapsulation for precavitated plastic IC packages of most types and sizes. Proven to work with copper and other technologies, PLASER allows final 'dry' decapsulation, down to the die surface, without the use of acid. PLASER uses a novel design incorporating BSET EQ's Plasma recipes, and FillerBlast™ technology
PLASER is available in a standalone format, that can be added to any decapsulation lab toolkit.
PLASER is also available as a fully integrated system into the SESAME 1000 LASER. The combined tool is dubbed SESAME 2000.
Click Additional Images to Enlarge
Product Highlights
- Available in STAND-ALONE or INTEGRATED versions
- Adds Final Decapsulation Capability with no acid required
- Enables Turnkey decapsulation -- in a single footprint
- Large Chamber Size -- can allow for multiple parts to processed simultaneously for higher volume decapsualtion.
| ITEM | DESCRIPTION |
|---|---|
| Main Unit | PLASER Plasma Chamber with automatic door |
| Material Removal Method |
Plasma and BSET FillerBlast™ |
| Filtering | Vacuum pump and Filter for particules |
| Mass Flow | 3 Mass Flow Controllers for O2, CF4 and other gases |
| Plasma type | ICP (Inductive Coupled Plasma) |
| RF | RF 300W generator |
| Control Unit | Automatic RF tune and Baratron vacuum Gauge |
| Controls |
Independent color LCD touchscreen gathering all the controls |
| Sample Thermal control | Thermal regulation of the sample stage (20/100°C) - option |
| Additional items | Mechanical parts for adaptation onto the SESAME1000 |
| FREE-STANDING SYSTEM | Please note that PLASER is also available as a free-standing floor unit, for use with SESAME and other pre-cavitation systems -- Footprint 32”W x 24” D x 42" Tall |
Note: ULTRA TEC is the representative for PLASER equipment in North America. Customers in other territories and for other applications should contact BSET EQ directly.
