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New Mass Production Fiber Polisher - FIBERTEC
Jan 31, 2012 - Santa Ana, CA: ULTRA TEC is proud to introduce a new mass-production fiber connector polisher.
FIBERTEC can polish between 10 and 24 connectors at a time. The new FIBERTEC has...
PLASER Offers Final Decapsulation with Plasma
PLASER, now available as a STAND-ALONE unit, ffers final decapsulation for precavitated plastic IC packages of most types and sizes....
Which ASAP-1® System is Right for My Lab?
We are asked many times to suggest which ASAP-1® System is the correct purchase for each client's FA, Counterfeit and Reliability Lab. ULTRA TEC offers a wide range of products to meet all SAP applications...
Parallel polishing of copper IC devices with ULTRAPOL Advance
A New YouTube Video on the ultratecusa Channel details the ULTRAPOL Advance Polisher being...
Precision Sawing for Small Workspaces & Smaller Budgets
For the user who wants all the functionality and unique control of cutting parameters offered by a high end saw, while working on a tight budget or with limited lab space, ULTRASLICE Compact provides...
DIGITAL ANGLE DIAL -- Measure your polishing angle to 0.01 degree precision
The Digital Angle Dial is an upgrade available for our ULTRAPOL Polishing Systems. It offers an improved customer interface for the precise selection of polishing angle -- achieving down to 1/100 degree of repeatable...
LASER plus PLASMA Decapsulation = SESAME 2000
SESAME 2000: A novel design for decapsulation with Plasma using BSET EQ's FillerBlast™ technology has been integrated into the SESAME 1000 This allows final decapsulation, down to the die surface, without...
