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RAPIDETCH
Single & Dual Acid Systems for Chemical Decapsulation
Key growth areas in semiconductor packaging call for devices where 'small is everything' -- for applications such as handheld computers, counterfeit protection, smartphones, tablets, UMPC's, music players, ipods, and GPS devices. The RAPIDETCH Series of Chemical Decapsulators has been designed form the ground-up with this requirement on mind, in addition to meeting the Industry's past, current and future product needs for packages containing - copper decapsulation, aluminum decapsulation, gold decapsulation, and polyamide decapsualtion.
EASY ACCESS CONTROLS
All system controls - program timers, temperature, acid mix, pressure -- are mounted on the front-panel of RAPIDETCH for easy access. This provides the user friendliness required by multi-tasking users in busy labs.
SAFER BY DESIGN
RAPIDETCH's use of negative pressure pumping technology provides an inherently operator-safe interface. Acid flow is regulated by the drawn vacuum.
No seal = no vacuum = no acid flow!
EASY MAINTENANCE
The system's design allows for easy and inexpensive extended maintenance -- all system components can be replaced by the user on-site. This optimizes up-time and puts the lab staff fully in control -- wherever the system is located throughout the world.
DUAL, SINGLE & PRE-MIXED ACID CAPABILITIES
The use of nitric and sulfuric acid mixes has become commonplace for modern package decapsulation. RAPIDETCH provides a new benchmark for the mixing of precise acid ratios and the control of acid temperature at the the etch head.
For users with a smaller variety of package types, or for those operating within tight budgets, a single acid system using single strength or pre-mixed acids, is available. For copper, aluminum, gold bond wires and polyamide coatings - recipes exist to optimize etch results.
Click Additional Images to Enlarge
The long reach arm allows for large boards to be mounted on the machine
Laser precavitated part(left) with addtl low temp RAPIDETCH final decap(right)
Product Highlights
- Etches precise openings in plastic packages of all sizes and compositions.
- Advanced pumping principle offers benefits in acid control, safety etc.
- Market-leading speeds for etch head heating & cooling. This provides maximum uptime when changing acid mixes and package types.
- Single and dual acid systems available.
- User-friendly extended maintenance.
- Intuitive control -- all system controls are front panel mounted.
| Order Code | Item | Description |
|---|---|---|
| 8420.1 | RAPIDETCH DUAL ACID ETCHER |
Includes: Integrated Etcher-controller unit, eight 5OOmL bottles, Bottle Holder, Basic Accessory Kit (Order Code: 8450.1) |
| 8425.1 | RAPIDETCH SINGLE ACID ETCHER | Includes: Integrated Etcher-controller unit, eight 5OOmL bottles, Bottle Holder, Basic Accessory Kit (Order Code: 8450.1) |
General & Safety Specifications
| Item | Description |
|---|---|
| Unit Size |
330mm (13") W X 360mm (14") 0 X 330mm (13") H (max), 9Kg (20 Ibs) |
| Bottle Box Size |
200mm (8") W X 250mm (10") 0 X 260mm (10") H (max) ,5Kg (10Ibs) |
| Power |
100-120VAC fused 3A or 220-240VAC fused 1.6A- 50/60Hz, 370W max, |
| Acid Mix Ratios (8420.1 unit only) |
All HN03 -10%.15%,20%,25%,30%,35%,40%,50%,100% -- All H2SO4
|
|
Etch Temperatures |
20C to 90C (nitric acid), 20C to 250C (sulfuric acid), 20C to 100C (mixed acids) |
| Etch Methodology | Plastic decapsulation by heated acid etch method. An Inherently operator-safe vacuum draw produces regulated acid flow. |
| Etch Times | 1-999 seconds (in 1 second increments) |
| Chemical Resistivities |
ETCHER: Acid-wetted materials are fluorine-resin or glass. Structural materials are PVC, Polypropylene, Stainless Steel and Aluminum. BOTTLE HOLDER: Acid-resistant PVC construction. True secondary containment for two 500mL supply bottles. One 1000mL acid waste bottle and trap bottle. Bottle Holder accepts Worldwide standard bottle types. |
| Certifications & Compliances |
RoHS, CE, SEMI S-2, SEMI S-2,93 |
| Safety Features |
VACUUM SYSTEM continually clears the etch area during process. ABORT PROCESS SWITCH terminates etch cycle and and initiates a pump purge cycle. EMO EMERGENCY-OFF Switch places system into safe condition. Rangeof FAULT MONITORS continuously check system performance. |
| Additional Notes & Requirements |
N2 for inert etch chamber is 2 psi max@ 10 cfm min. Fume hood requiredwith acid-resistant work surface, eyewash station. Relevant standard protective clothing, gloves, eyewear, tools are required. |
