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SAP Tools - Sub-mm Diameter
Sub-mm Tools
Specialist SAP tools for very small die sizes and cavity requirements - FIB trenches, decapsulation around bond wires, finding fiducial marks etc.
Product Highlights
- Recommended For Cavity / Die Sizes up to 2mm
- Suits all ASAP-1® systems
- Note:actual tool lifespans will vary
- Sub-mm tools have a general lower lifespan than the standard tool sizes.
0.7mm Diameter Tools
Step |
Order Code |
Application |
Tool Type |
Lubricant Used |
Approx. tool lifespan (# applications) |
|---|---|---|---|---|---|
|
1 |
5210. 07 |
Removing Package Materials |
Coarse diamond |
Water or extender |
8 |
|
2 |
5215. 07 |
Copper Paddle Removal
|
Milling Tool |
Extender |
2 |
|
3 |
5260.07 |
Substrate thinning |
Fine diamond |
Water or extender
|
8 |
|
4 |
5295. 07 |
Initial Polish
|
XYLEM |
Extender + diamond paste
|
5 |
|
5 |
5295. 07 |
Medium Polish
|
XYLEM |
Extender + diamond paste
|
5 |
|
6 |
5295. 07 |
Final Polish
|
XYLEM |
Colloidal Silica |
5 |
0.4mm Diameter Tools
Step |
Order Code |
Application |
Tool Type |
Lubricant Used |
Approx. tool lifespan (# applications) |
|---|---|---|---|---|---|
|
1 |
5210. 04 |
Removing Package Materials |
Coarse diamond |
Water or extender |
8 |
|
2 |
5215. 04 |
Copper Paddle Removal
|
Milling Tool |
Extender |
2 |
|
3 |
5260.04 |
Substrate thinning |
Fine diamond |
Water or extender
|
8 |
|
4 |
5295. 04 |
Initial Polish
|
XYLEM |
Extender + diamond paste
|
5 |
|
5 |
5295. 04 |
Medium Polish
|
XYLEM |
Extender + diamond paste
|
5 |
|
6 |
5295. 04 |
Final Polish
|
XYLEM |
Colloidal Silica |
5 |
