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 Precision sawing, dicing, flat lapping and polishing equipment for semiconductor and electro-optic materials and applications such as back-grinding, cross-sectioning and edge polishing. Lithium niobate (LiNbO3), indium phosphide (InP), silicon and compound semiconductors etc all prepared defect and scratch-free with precision control of all surface parameters. |
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Key Literature
LAPPING & POLISHING
Requirements to produce lapped, back-lapped and polished crystals, wafers, and components to optical surface quality and precise dimensional control are met with ULTRA TEC equipment. MULTIPOL precision lapping and polishing machines were developed specifically for producing high quality, results on crystal materials of widely varying mechanical and physical properties. The highest quality sample preparations are yielded when MULTIPOL is used in conjunction with a precision polishing jig. MULTIPOL offers true flat lapping in a bench-top package, allowing the processing of 2", 3" and 4" diameter wafers. The use of precision jigs and the MULTIPOL are discussed at greater length, regarding wafer lapping and polishing. The system also provides precise control of all surface-producing parameters for applications such as edge-polishing of electro-optic waveguides, GRIN lenses and planks.
The autocollimator (pictured above in use with a precision jig) is an optical tool that works in conjunction with the precision jig to achieve parallelism on items that provide semiconductor and/or electro-optic properties based on the precision of two precisely (down to a few seconds of arc) precisely parallel surfaces. For further information on evaluating polished surfaces and use of ULTRA TEC’s equipment, click here. For lapping and polishing operations that have smaller surfaces, or would benefit from the fastest, most convenient processing ULTRAPOL machines, provide the answer. INTEGRATED APPROACH For the production of electro-optic, integrated optic and related components, ULTRA TEC has developed a system for conveniently sawing, lapping and polishing, which allows the transfer of samples and workpieces through the process sequence (from ULTRASLICE saw to ULTRAPOL polishing machine), with the use of advanced "Quick Release" workholders. There exist workholders for most sizes, types, shapes and orientations of components, with ULTRA TEC’s fabrication services available for custom designs and configurations, when required. For more details of our work in this area, click here. ULTRA TEC also offers equipment for precision dicing of semiconductor and electro-optic wafers and sheets.
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