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Semiconductors

Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies. ULTRA TEC has given particular attention to supplying products that span the wide application range, from systems for preparing silicon, gallium arsenide (GaAs) etc, nanotechnology, MEMS, and devices to supplying advanced flat lapping and precision sawing equipment for back lapping (back grinding).

 

Our Product Solutions include:

ULTRASLICE Precision Saws

ULTRAPOL Advance for flat lapping of small devices

MULTIPOL systems for up to 4" diameter components

ASAP-1 IPS Precision Selected Area Preparation System for decapsaltion and backside thinning and polsihing of live ic packages.

 

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Chip-Off Equipment for Digital Forensics

ULTRA TEC offers Cold Chip-off Equipment for Digital Forensics applications. See a video intro to our THIN BLUE (product)Line by visiting here.

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TEC Tip

Easy sample transfer to and from the Hotplate

The Hotplate Transfer Device holds the sample holder during sample mounting / demounting and allows for rapid transfer when hot. No need for tongs! Click for more