SESAME PLASER Laser + Plasma Decapsulation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.

At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full protection from LASER radiation, in compliance with applicable VBG 93, DIN EN, and CE  standards.

The integrated optical vision system provides constant sample monitoring. A previously-taken X-Ray or an Acoustic Microscope image can be superimposedonto the SESAME's live component image to provide additional data for successful decpasulation.

SESAME's intuitive software incorporates drawing tools for definition of the material to be removed which can be drawn onto the component image. The actual amount of material removed can be measured by camera focal-depth techniques or by using an external mechanical indicator.

Prior to the LASER ablation process, the component is scanned by a red pilot LASER. The system's firmware controls all process parameters such as power, frequency, scan speed and focal distance. All process parameters can be stored by specific component and product family for easy recall.

Following laser ablation, the die surface can be revealed with a low temperature wet etch, applied either manually (with a suitable dropper) or automatically (with an automated acid decapsulation machine), avoiding electric and mechanical alteration of the component.

NOTE: SESAME PLASER Technology incorporates mutual Patents and IP developed by CNES, BSET EQ and DIGIT CONCEPT SA