Equipment
Fiber Polishing
Introducing the new FIBERTEC...
ULTRA TEC is proud to introduce a new mass-production connector polisher. FIBERTEC can polish between 10 and 24 connectors at a time.
Drawing on ULTRA TEC's unique legacy and in-depth knowledge of the fiber polishing process, the new FIBERTEC offers market...
ULTRATOOL was designed for manual polishing of fibers, either supported (connectorized) or non-supported (bare fibers), The tool uses various replaceable modules which are available for all types of connectors -- if needed, custom modules can be designed and manufactured by ULTRA TEC.
Key to...
UT.MINIPOL.1 is a fiber polishing system designed for prototyping and small production.
All connector types may be prepared by the system, including SC, FC, ST, D4, SMA, Bare fiber, PC, and Flat polishes are all accommodated by simple changes of the lap and/or the workholder....
CTC can be used at the bench-top or in the field. The simple logistics of the unit make it extremely user-friendly. No previous experience is needed to operate the unit.
CTC is a low to medium volume production unit that can be used for PC, APC, and Flat polishing.
CTC ...
Developed for 'In-the-field' and 'Retro-Polishing' applications, the FTTx portable connector/termini/contact polisher from ULTRA TEC provides the performance required by installation professionals for the FTTx, LAN, CATV, and Aircraft/shipboard applications.
Industry-standard...
Selected Area Preparation
Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-corrosive gas and uses mass flow controllers with precise gas mixing. This is important to achieve selectivity and other issues and other issues...
Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC...
Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation.
In recent years,...
Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and accurate. ASAP-1® DECAP brings cost-effective, bench-top advanced decapsulation and...
Key growth areas in semiconductor packaging call for devices where 'small is everything' -- for applications such as handheld computers, counterfeit protection, smartphones, tablets, UMPC's, music players, ipods, and GPS devices. The RAPIDETCH Series of Chemical Decapsulators has been...
>> Download System PDF Datasheet
Setting X-Y SAP Parameters with Target -- Scan shows Tool Path
Decapsulation with 0.4mm Diameter Milling Tool
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Decapsulation
SESAME 500 Laser Ablation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.
At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full protection from LASER...
The FA-2000-P offers decapsulation and depassivation of packaged devices in an anisotropic manner for the worldwide Semiconductor industry.
Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-...
SESAME PLASER Laser + Plasma Decapsulation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.
At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full...
SESAME 1000 Laser Ablation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice.
At the system's heart is a Nd:YAG 1064nm diode-pumped LASER, which is housed inside a chamber to provide full protection from LASER...
Metrology
ICis is a modular microscope offering up to 3 standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thickness...
ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a ‘single box’ solution, incorporating an lcd screen and all the controls required to align the sample.
The...
Our patented ULTRASPEC-III coherent laser illumination source is designed to meet the needs of today’s photoemission microscopes as well as backside imaging stations.
In standard configuration with laser wavelengths at 660nm, 1064nm and 1300nm, you have the immediate flexibility to illuminate...
ULTRA TEC's height indicators allow for a no-nonsense method of accurately measuring material removed by surface preparation processes.
They provide an 'insurance policy' reference point, in case machine settings are forgotten or as a second opinion.
A choice of...
Lapping and Polishing
MULTIPOL 8 and 10 from ULTRA TEC are versatile lapping and polishing systems capable of preparing the most demanding specimens required by Research and Industry. Primarily designed for failure analysis, research and pilot-scale production applications, they allow for many methods of sample holding-...
ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s.
Key applications of...
ULTRAPOL Sculpted end polisher offers the fiber optic communications industry the ability to produce accurate end profiles on bare optical fibers. Improved design of fiber holding, and all processing characteristics, provide concentricity of a couple of microns. This means that accurate...
ULTRAPOL End & Edge Polisher has been designed to provide accurate lapping and polishing for research and industrial applcations. Key to the high quality performance of the unit is the calibration of the polishing base and the advanced angular control provided by the polishing head.
Built-...
ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing,
The system has an 8 inch, replaceable polishing plate, faucet coolant, and dual lap direction.
Several specialist manual polishing tools are available for the system:
ULTRATOOL...
Precision Sawing
ULTRATRIM is a low cost, entry-level, precision sawing machine for producing rapid cross-sections for microscopy and QC checks.
The saw includes a straightforward coolant reservoir, the saw blade dips into the reservoir for effective cooling and lubrication of the sawing process. An...
Developed to facilitate precision sectioning applications in Industry and Research, ULTRASLICE Precision Saw provides the user with a unique combination of features:
VERSATILE SAMPLE HOLDING
The system may be readily converted to handle sample cutting requirements of most shapes, sizes, and...
For the user who wants all the functionality and unique control of cutting parameters offered by a high end saw, while working on a tight budget or with limited lab space, ULTRASLICE Compact provides the answer.
The system features an integral coolant recirculation system which...
AR Coating
ARC-lite is the world's first system to offer fast, reliable, room temperature AR coatings on package and wafer level devices. ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The sample produced are optimized and require no baking.
ARC-lite reaches maximum...
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Featured Product
ICis is an advanced modular microscope offering up to 3 standard imaging modes -- NIR for Backside Imaging, UV for highest resolution, and Megapixel Color Imaging for topside parallel polishing. The...
TEC Tip
The Hotplate Transfer Device holds the sample holder during sample mounting / demounting and allows for rapid transfer when hot. No need for tongs! Click for more
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