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Ultra Tec

Equipment

Decapsulation

LASER ETCH 2

LASER ETCH 2 Decapsulation System has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice. At the system's heart is a Nd:YAG 1064nm fiber LASER, which is housed inside a chamber to provide full protection from LASER radiation,...

FA-2000-P Plasma Decapsulator

The FA-2000-P offers decapsulation and depassivation of packaged devices in an anisotropic manner for the worldwide Semiconductor industry. Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-...

Lapping and Polishing

ULTRAPOL Fiber Lensing Machine

ULTRAPOL Sculpted end polisher offers the fiber optic communications industry the ability to produce accurate end profiles on bare optical fibers. Improved design of fiber holding, and all processing characteristics, provide concentricity of a couple of microns. This means that accurate...

ULTRAPOL Basic

ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing, The system has an 8 inch, replaceable polishing plate, faucet coolant, and dual lap direction.  Several specialist manual polishing tools are available for the system: ULTRATOOL...

ULTRAPOL End & Edge Polisher

ULTRAPOL End & Edge Polisher has been designed to provide accurate lapping and polishing for research and industrial applcations. Several thousand of these units are already assisting users in a wide range of technical disciplines. Key to the high quality performance of the unit is the...

ULTRAPOL Advance

ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s. Key applications of...

NANOpol

NANOpol offers the fiber optic communications industry the ability to produce accurate polished bevels on bare optical fibers.  Angular control is achieved with the advanced positioning features of the integral micropositioned polishing head.  Designed for the price-conscious university...

ULTRAPOL Manual Polishing Station

Our bench-top workstation for manual polishing provides a simple, low cost way to 'get things done' in the lab. The integral fluid containment tray allows for polishing fluids and abrasives to be collected during the workday and discarded when full, or at the end of a shirft. The full 8...

MULTIPOL

MULTIPOL 8 and 10 from ULTRA TEC are versatile lapping and polishing systems capable of preparing the most demanding specimens required by Research and Industry. Primarily designed for failure analysis, research and pilot-scale production applications, they allow for many methods of sample holding-...

Precision Sawing

ULTRASLICE

Developed to facilitate precision sectioning applications in Industry and Research, ULTRASLICE Precision Saw provides the user with a unique combination of features: VERSATILE SAMPLE HOLDING  The system may be readily converted to handle sample cutting requirements of most shapes, sizes, and...

MACROTOME

  ULTRASLICE Macrotome precision diamond saw, is a quiet, direct drive design for smooth, chatter free slicing system for important and fragile industrial, hard tissue, biological and certain industrial specimens. The system suits Fish & Game applications, such as Otolith ...

ULTRATRIM

ULTRATRIM is a low cost, entry-level, precision sawing machine for producing rapid cross-sections for microscopy and QC checks. The saw includes a straightforward coolant reservoir, the saw blade dips into the reservoir for effective cooling and lubrication of the sawing process. An...

ULTRASLICE Compact

For the user who wants all the functionality and unique control of cutting parameters offered by a high end saw, while working on a tight budget or with limited lab space, ULTRASLICE Compact  provides the answer. The system features an integral coolant recirculation system which...

Selected Area Preparation

PEEC

  PEEC is a new, patent pending, characterization module for ASAP-1 IPS digital sample preparation system. PEEC improves sample preparation techniques, particularly at extremely thin remaining silicon thickness (RST). PEEC offers several plotting and mapping modes that work in...

ASAP-1 Basic

Note: Legacy Product Information - A newer version of this product is available. Click here Every lab can now produce accurate, reproducible pre-cavitated, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decapsulation is now straightforward and...

ASAP-1 IPS

Since product launch, ASAP-1® hardware has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement, radiation testing, and competitive analysis have come to rely on for backside preparation. ULTRA TEC...

Blue Mill

Every lab can now produce accurate, reproducible pre-cavitated devices -- ready for final decapsulation with RAPIDETCH, other chemical decapsulators, or PLASER plasma decapsulation system Flip-chip and power chip mechanical pre-decapsulation is now straightforward and accurate. BLUE MILL brings...

RAPIDETCH

The RAPIDETCH Chemical IC Decapsulator series has been designed form the ground-up to meet the Industry's past, current and future product needs for ic decapsulation, counterfeit protection and packages containing - copper decapsulation, aluminum decapsulation, gold decapsulation...

FA-2000 RIE System

Anisotrophic etching offers the aspect ratios needed to preserve the functionality of the device being treated. The system is capable of using any non-corrosive gas and uses mass flow controllers with precise gas mixing. This is important to achieve selectivity and other issues and other issues...

ASAP-1 IPS - Resources

          >> Download System PDF Datasheet   System Introduction - 'The Benefits of Going Digital'   Plastic Package Tilt Alignment on ASAP-1 IPS   Thermal Relaxation of IC Packages     Setting X-Y SAP Parameters with Target -- Scan...

ASAP-1

6360.1S ASAP-1 System with optical alignment
Since product launch of the original hardware, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation. In recent years,...

Fiber Polishing

FIBERTEC

  Introducing the new FIBERTEC... ULTRA TEC is proud to introduce a new mass-production connector polisher. FIBERTEC can polish between 10 and 24 connectors at a time. Drawing on ULTRA TEC's unique legacy and in-depth knowledge of the fiber polishing process, the new FIBERTEC offers market...

ULTRATOOL

ULTRATOOL was designed for manual polishing of fibers, either supported (connectorized) or non-supported (bare fibers), The tool uses various replaceable modules which are available for all types of connectors -- if needed, custom modules can be designed and manufactured by ULTRA TEC. Key to...

UT.Minipol.1 Polisher

UT.MINIPOL.1 is a  fiber polishing system designed for prototyping and small production.  All connector types may be prepared by the system, including SC, FC, ST, D4, SMA, Bare fiber, PC, and Flat polishes are all accommodated by simple changes of the lap and/or the workholder....

CTC Polisher

FIBER POLISHER FOR CONNECTORS, TERMINI & CONTACTS
CTC can be used at the bench-top or in the field. The simple logistics of the unit make it extremely user-friendly. No previous experience is needed to operate the unit.   CTC is a low to medium volume production unit that can be used for PC, APC, and Flat polishing. CTC ...

FTTx

Developed for 'In-the-field' and 'Retro-Polishing' applications, the FTTx portable connector/termini/contact polisher from ULTRA TEC provides the performance required by installation professionals for the FTTx, LAN, CATV, and Aircraft/shipboard applications. Industry-standard...

Metrology

ICis Microscope

ICis is a modular microscope offering up to 3 standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thickness...

ULTRACOLLIMATOR

ULTRACOLLIMATOR modules allow the user to produce the finest results of sample parallelism with both flat lapping and selected area preparation machines. The units produce a ‘single box’ solution, incorporating an lcd screen and all the controls required to align the sample. The...

ULTRASPEC-III

Our patented ULTRASPEC-III coherent laser illumination source is designed to meet the needs of today’s photoemission microscopes as well as backside imaging stations. In standard configuration with laser wavelengths at 660nm, 1064nm and 1300nm, you have the immediate flexibility to illuminate...

Height Indicators

  ULTRA TEC's  height indicators allow for a no-nonsense method of accurately measuring material removed by surface preparation processes. They provide an 'insurance policy' reference point, in case machine settings are forgotten or as a second opinion.  A choice of...

AR Coating

ARC-lite

ARC-lite is the world's first system to offer fast, reliable, room temperature AR coatings on package and wafer level devices. ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The sample produced are optimized and require no baking. ARC-lite reaches maximum...
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Featured Product

Polishing Matters!

A Series of Banner Ads that run in MICROSCOPY TODAY magazine and related microscopy journals. The Ads highlight ULTRA TEC's products and commitment to advanced materials and microscopy through metallography,...

Company News

PEEC Endpoint Characterization Introduced @ ISTFA 2013

November 5, 2013 -- San Jose, CA -- ULTRA TEC Manufacturing, Inc. (Santa Ana, CA) announces the availability of a new technology, PEEC, for use with its popular ASAP-1 IPS Digital Preparation System...

TEC Tip

Easy sample transfer to and from the Hotplate

The Hotplate Transfer Device holds the sample holder during sample mounting / demounting and allows for rapid transfer when hot. No need for tongs! Click for more

Note: ULTRA TEC is proud to operate a continuous product improvement program. Product specification and appearance are subject to modification without prior notification.