Primary links

Thermal Relaxation for Improved Sample Preparation of 'Non Flat' IC's

May 14, 2012 -- (Santa Ana, CA) ULTRA TEC Mfg, Inc. is proud to announce the availabilty of a new modular upgrade for its ASAP-1 IPS Digital Preparation System.

The Thermal Relaxation Stage provides a patent pending method of flattening stressed and bowed dice within packages, allowing for greatly improved parallelism and flatness in subsequent backside thinning and polishing operations. A precise temperature can be set for a known part or raised in intervals until the optimum surface flatness is achieved. A hotplate mode allows for fast and accurate sample mounting and de-mounting, 'in situ', with standard lab adhesives such as Crystal Wax.

The Thermal Relaxation Stage joins ULTRA TEC's unique line of modular upgrades for the ASAP-1 IPS system -- namely FORCE FEEDBACK, and CURVATURE CORRECTION. These upgrades supplant the FA Engineers toolkit for the improved preparation of 'real world' packages -- the suite of solutions being dubbed "3D-SAP"

For more information, visit or call us on +1 714 542 0608. 


Bookmark and Share

Featured Product


ULTRAPOL FIBERLAB Module System is a new product in ULTRA TEC’s Fiber Optic Polishing Product Line.  The main...


Easy sample transfer to and from the Hotplate

The Hotplate Transfer Device holds the sample holder during sample mounting / demounting and allows for rapid transfer when hot. No need for tongs! Click for more