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Wafer Backside Preparation Kit
Order Code: 6361.8
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Product Highlights
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For analog ASAP-1 systems
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Allows ASAP-1 to reach any die on an 8-inch (203mm) diameter wafer
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Allows for backside analysis of wafers without dicing and packaging
| Order Code | Description |
|---|---|
| 6361.8 | 8 inch Wafer Backside preparation Kit: includes aluminum plate, mounting hardware for ASAP-1, depth gauge, hold down clamps, glass alignmnent plate |
