ULTRA TEC Manufacturing, Inc.

October 2008

New ULTRASLICE Compact Precision Saw offers high quality slicing and dicing in a small foot-print bench-top machine

ULTRA TEC is pleased to announce the launch of ULTRASLICE Compact, a small footprint cross-sectioning system for the high tech industries, where budgets are limited or the available bench space is small. The unit has a motorized table feed, accepts many workholding accessories, and a has a footprint of only 14 inches (35cm) wide by 16 inches (40 cm) deep.

For more information, click here

August 2008

NEW OPTICS INDUSTRY ADVERTISING

July 2008

NEW FIBER ADVERTISING

>> Click image for full size.

June 2008

SESAME 1000 LASER DECAPSULATOR

ULTRA TEC announces the North American launch of SESAME 1000 Laser Ablation System.

SESAME 1000 has been specifically designed for effective decapsulation of IC packages, containing either a single die or multiple dice. Developed in Europe by our partners at DIGIT CONCEPT and CNES, SESAME already has an installed base at several key semiconductor fabs.

At the system's heart is a Nd:YAG 1064nm diode-pumped laser.

SESAME 1000 further strengthens our product portfolio of industry-leading products for sample preparation -- whether TOPSIDE, BACKSIDE or CROSS-SECTIONAL Analysis.

For more information, click here.

April 2008

RAPIDETCH CHEMICAL DECAPSULATORS

ULTRA TEC announces the launch of the RAPIDETCH Series of Chemical Decapsulators. Designed from the ground-up with a view to etching all sizes of plastic electronic package - from SO's to board-level devices, RAPIDETCH further strengthens our product portfolio of industry-leading products for sample preparation -- whether TOPSIDE, BACKSIDE or CROSS-SECTIONAL Analysis.

For more information, click here.

March 2008

See us @ SEMICON CHINA -- MARCH 18-20

We are proud to be located on the Booth of our China Sales Partners, BE-FIRST TECHNOLOGY

The Booth NO. is Hall:W2-2169.

Applications engineers will be on hand to discuss ULTRA TEC's product offerings for topside, backside and cross-sectional analysis. BE-FIRST offer a complete line of test, sample preparation and imaging equipment.

February 2008

NEW Ads in Selected MICROSCOPY Journals

> Click image for full size ad

Janyary 2008

New ASAP-1 Ads

> Click image for full size ad

November 2007

ULTRA TEC unveils major upgrades to the ASAP-1 Product Line

ULTRA TEC unveils a redesign in the ASAP-1 base units at the recent ISTFA Conference this year. In addition to the similar elegant and effective user interface that continues to equip the FA & Materials labs of the world, the new ASAP-1 systems provide a fully integrated solution for TOPSIDE, BACKSIDE & DECAPSULATION applications.

New features and options include upgraded ULTRACOLLIMATOR technology, a High torque motor (for hard and difficult materials, and thick heat sinks etc) and also (up to) a full 2-inch amplitude travel (for large dice and cavity requirements)

We are pleased to discuss the new systems and features, and feel free to ask how you might take advantage of a “trade in” to upgrade to the latest in Selected Area Preparation!

Download the new SELECTED AREA PREPARATION Brochure by clicking here

July 2007

Out and About

In an unusual moment, members of the ULTRA TEC Semiconductor Applications team were caught in the same place at the same time. Pictured (from left) is Jay DeAlday (Engineering & Apps Specialist), Heenal Patel (Applications Specialist) & Tim Hazeldine (VP Sales & Marketing).

May 2007

ULTRAPOL Advance Brochure in Stock

ULTRA TEC is pleased to announce a new brochure is available for ULTRAPOL Advance. User feedback to the has been overwhelmingly positive towards the system -- particularly regarding Advance's patented optical alignment features and the quality of results obtainable.

Please contact us for a printed brochure, or you can download one here.

March 2007

ULTRASLICE moves to the Cutting Edge

ULTRA TEC is pleased to announce a major upgrade to our ULTRASLICE Precision Saw. ULTRASLICE has been redesigned to offer much more convenient & effective control of all cutting parameters. The splashguard is now hinged to allow for easy access to the cutting area. Now fitted as standard is the 'Z-spindle' which provides rapid repositioning of cutting height -- perfect for dealing with workpiece variations, as well as optimizing dicing type cuts.

Click here to read more about ULTRASLICE

December 2006

Recent ads for our Failure Analysis Products. Click on thumbnails for full size image ...

November 2006

A big thank you to all those who visited our booth at ISTFA 2006 in Austin Texas.

October 2006

MICROSLICE gets a new look. Our popular precision annular saw has now been relaunched in ULTRA TEC's trademark color scheme, with improved features. To find out more about this unique product, CLICK HERE

October 2006

September 2006

Video Tutorial

June 2006

enabling FAILURE ANALYSIS Newsletter -- Issue 6

-- Download now

March 2006

Selected Area Preparation Consumables Guide

November 2005

ULTRA TEC launches major new polishing machine

ULTRAPOL advance is an all-in-one flat lapping & polishing workstation for the preparation of flat surfaces. Advance's unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC's and samples for electron and related microscopy disciplines.

For more information click here