POLISHING SOLUTIONS, HELPING YOUR LAB TO SHINE!

ULTRA TEC designs, manufactures and provides advanced surface & sample prep equipment and consumables for both routine and custom applications in a multitude of research and industrial settings.

Applications Equipment Consumables

Markets & Applications We Serve...

Decapsulation

Removal of electronic packing materials - primarily to gain access to the chip inside - is necessary for many reasons including failure analysis, electrical testing, counterfeit prevention and QC.
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FIBER OPTICS

ULTRA TEC provides a leading range of polishers to the fiber optic industry -- from manual polishing and low production of single patchcords, through 'in the field' polishing, right up to mass production on our new FIBERTEC machine.
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ELECTRONIC FAILURE ANALYSIS

ULTRA TEC offers the industry's widest range of sample preparation equipment to assist the electronic engineer in tackling problems head-on.
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COUNTERFEIT PREVENTION

Counterfeit products are entering the marketplace through increasingly sophisticated methods. These products jeopardize the entire supply chain and already cost the electronics industry many millions of dollars each year.
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SEMICONDUCTORS

Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies.
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Bare Fibers

ULTRA TEC has developed both products and techniques for providing support to the generally fragile bare fiber during lapping and polishing, which can achieve the results required for most bare fiber requirements.
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OPTICS & ELECTRO OPTICS

The requirement of to produce optical surfaces that transmit light correctly is widespread through Industry. ULTRA TEC has had a wide involvement with clients requiring generally flat surfaces on smaller optical sub-assembly components.
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MATERIALS SCIENCE

Cutting and Polishing is widespread throughout industry and research. ULTRA TEC offers a wide range of precision surface and sample preparation equipment to meet the challenge.
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MEDICAL

Medical devices such as endoscopes, arthroscopes and many others require controlled transmission of light for success in their end use. ULTRA TEC’s equipment achieves the highest quality polished surfaces on optic, electro-optic and fiber optic components.
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CHIP-OFF FOR DIGITAL FORENSICS

Chip-Off is an important technique for digital forensics labs that need to access data from mobile devices, such as cellphones and tablets by matter subtraction.
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Equipment

Browse Our Selection Of Precision Equipment

ARC-lite
Antireflective Coating System For Backside Analysis
Equipment, Selected Area Preparation
Fast and convenient – 45 second process

Up to 30% more transmitted photon efficiency

Up to 60% improved contrast under NIR

Inexpensive to own and operate

Bench-top, quiet, room temp. process

All package types and sizes

RC can be done ‘in-house’ – NO BAKING

Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
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ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample Preparation
Chip-Off for Digital Forensics, Equipment, Selected Area Preparation
IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution

Adaptive 3D Mesh & Curve Mapping

Import Overlays – use X-RAY, C-SAM images to improve targeting

Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning

High-Def Digital Cameras — all native 4K (UHD)

Option for (up to) 32” Vision Monitor

Program by Touch, Mouse/Keyboard or REMOTELY
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ASAP-1® IPS
Digital Selected Area Preparation System
Equipment, Selected Area Preparation
2nd Generation Unit (for 2024)

Accurately decaps, thins & polishes

die, package, wafer and board-level

2 UHD Stage Cameras – front & side

Target Camera and overlay software options

Touchscreen with physical joystick & encoders

Full 100 x 100 mm Stage area

X, Y and Z axes all have deep sub-micron accuracy
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ULTRAPOL Basic
Manual Lapping & Polishing Machine
Buy Online, Chip-Off for Digital Forensics, Equipment, Lapping and Polishing
Cost-effective manual polisher

High Torque mechanism

In-built coolant system

Can be used with manual tools

Upgradeable with Long Arm Positioner

High Quality Build
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Blue Mill
Milling, Chip-off and IC Pre-Cavitation Machine
Chip-Off for Digital Forensics, Equipment
Complete Solution – NO COMPUTER REQUIRED!

No programming or ‘G-Coding’ experience required

Great milling results for users of all experience levels

Built to last – heavy-duty solid steel welded cabinet – with powder coat finish

Cold Chip-off for Digital Forensics of NAND Flash

Extremely Compact Footprint

For the budget conscious user who needs industry-proven results
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