A new physical-contact Top Surface Scanning mode joins the feature set on ULTRA TEC’s ASAP-1 IN SITU Selected Area Prep System. Top Surface Scanning proves especially advantageous for when removing distinct successive material layers within semiconductor packages — such as multi-die stacks — where dies often need to be individually mapped to ensure resultant decapsulation success. Top Surface Scanning, moreover, …

ULTRA TEC Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station. The new software tools enable profiling and processing of curved and warped surfaces seen in the wide array of today’s packaged IC devices. These new adaptive techniques build on ASAP-1 In Situ’s unique built-in through-thickness …

ULTRA TEC (Santa Ana, CA) are pleased to announce that 1st Place in the Color Images Category in the EDFAS 2018 Photo Competition was won by Tim Hazeldine, VP Sales & Marketing. —————- The image entitled “The Fire Inside” is shown below: “The Fire Inside — Visible light-illuminated view of a backside ultrathinned flip chip, showing emerging circuitry”. — ISTFA 2018 —— …