Bare Fibers

The use of fiber lensing -- that is the shaping of optical fibers to act as  integrated lenses -- in addition to fibers’ light delivery requirements -- is widespread through high-tech Industry & Research.

Bare fibers may need to be polished with a range of end geometries -- flat, cone-shaped, beveled or chisel-shaped ends -- at various angles, to enable specific ‘lensing’ effects. This takes advantage of focal points and spot sizes for various material and optical properties.

Lensed fibers can be used for pigtailing active devices, sensors, data-collection, detectors and laser power delivery for communications, medical, optoelectronics and biophotonics and many more fields. The opposite end of a cable is often connectorized with standard communications or military connector types.

Bare fibers are generally fragile, especially when of small diameter, and must be held and manipulated safely during the mechanical lensing operation. Effective one and two-step preparation techniques have been developedwhich utilize fixed abrasive films.

ULTRA TEC has developed products and techniques for providing support to the generally fragile bare fiber during lapping and polishing, which can achieve the results required for most bare fiber requirements.

The FIBERLAB Microscope is available for both OFF-LINE and ON-LINE QC and production measurements.

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Our Solutions Include...

Our Decapsulation Products Include


    5-Axis CNC Mill for Selected Area Sample Preparation
    • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
    • Adaptive 3D Mesh & Curve Mapping
    • Import Overlays – use X-RAY, C-SAM images to improve targeting
    • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
    • High-Def Digital Cameras — all native 4K (UHD)
    • Option for (up to) 32” Vision Monitor
    • Program by Touch, Mouse/Keyboard or REMOTELY
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  • ASAP-1® IPS

    Digital Selected Area Preparation System
    • 2nd Generation Unit (for 2024)
    • Accurately decaps, thins & polishes
    • die, package, wafer and board-level
    • 2 UHD Stage Cameras – front & side
    • Target Camera and overlay software options
    • Touchscreen with physical joystick & encoders
    • Full 100 x 100 mm Stage area
    • X, Y and Z axes all have deep sub-micron accuracy
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  • Blue Mill

    Milling, Chip-off and IC Pre-Cavitation Machine
    • Complete Solution – NO COMPUTER REQUIRED!
    • No programming or ‘G-Coding’ experience required
    • Great milling results for users of all experience levels
    • Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
    • Cold Chip-off for Digital Forensics of NAND Flash
    • Extremely Compact Footprint
    • For the budget conscious user who needs industry-proven results
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