Electronic Failure Analysis
Electronic Failure AnalysisThe ever increasing complexity of circuitry and related component packaging demands ever better quality in the sample preparation of electronic devices for failure analysis, competitive analysis and yield enhancement. ULTRA TEC offers the industry's widest range of sample preparation equipment to assist the electronic engineer in tackling problems head-on.
BACKSIDE PREPARATION
Since product launch in 1999, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation. In recent years, driven by exponential growth of newer packaging types; CSP, MCM, BGA, flip chip to name a few; in addition to ever more demanding analytical methods, the applications array has been expanded to enable mechanical decapsulation, assurance of RAD-hard devices and topside de-processing.
ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The samples produced are wavelength-optimized and require no baking.
PARALLEL POLISHING & X-SECTIONING
Rapid, convenient, and reproducible saw cuts can be made with ULTRASLICE precision saws to reveal hidden defects, after subsequent lapping and polishing.
ULTRAPOL Advance parallel lapping offers high quality samples preparation, whether for topside, backside or cross-section. Use of the ULTRACOLLIMATOR makes sample alignment fast, accurate and repeatable compared with older systems that require long-winded mechanical indicators for alignment.
DECAPSULATION
Decapsulation is covered in more detail in the DECAPSULATION Application Area. Mechanical decapsulation brings with it several key benefits including extremely vertical ‘etch’ walls, extreme accuracy in setting the stopping distance, and the ability to add newer electronic endpointing methods.
Our Solutions Include...
-
ARC-lite
Antireflective Coating System For Backside AnalysisLearn More Quote Add to cart- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
-
ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample PreparationLearn More Quote Select options- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
-
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More Quote Select options- 2nd Generation Unit (for 2024)
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
-
ULTRAPOL Advance
Flat Lapping and Polishing MachineLearn More Quote Select options- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
-
ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic ComponentsLearn More Quote Select options- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
Further Reading
Product Brochures
