Electronic Failure Analysis

The ever increasing complexity of circuitry and related component packaging demands ever better quality in the sample preparation of electronic devices for failure analysis, competitive analysis and yield enhancement. ULTRA TEC offers the industry's widest range of sample preparation equipment to assist the electronic engineer in tackling problems head-on.

BACKSIDE PREPARATION

Since product launch in 1999, ASAP-1® has become the standard piece of preparation equipment that engineers involved in disciplines such as failure analysis, yield enhancement and competitive analysis have come to rely on for backside preparation. In recent years, driven by exponential growth of newer packaging types; CSP, MCM, BGA, flip chip to name a few; in addition to ever more demanding analytical methods, the applications array has been expanded to enable mechanical decapsulation, assurance of RAD-hard devices and topside de-processing.

ARC-lite is used as a free-standing unit for AR coating polished backside surfaces. The samples produced are wavelength-optimized and require no baking.

PARALLEL POLISHING & X-SECTIONING

Rapid, convenient, and reproducible saw cuts can be made with ULTRASLICE  precision saws to reveal hidden defects, after subsequent lapping and polishing.

ULTRAPOL Advance parallel lapping offers high quality samples preparation, whether for topside, backside or cross-section. Use of the ULTRACOLLIMATOR makes sample alignment fast, accurate and repeatable compared with older systems that require long-winded mechanical indicators for alignment.

DECAPSULATION

Decapsulation is covered in more detail in the DECAPSULATION  Application Area. Mechanical decapsulation brings with it several key benefits including extremely vertical ‘etch’ walls, extreme accuracy in setting the stopping distance, and the ability to add newer electronic endpointing methods.

Our Solutions Include...

  • ARC-lite

    Antireflective Coating System For Backside Analysis
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    • Fast and convenient – 45 second process
    • Up to 30% more transmitted photon efficiency
    • Up to 60% improved contrast under NIR
    • Inexpensive to own and operate
    • Bench-top, quiet, room temp. process
    • All package types and sizes
    • RC can be done ‘in-house’ – NO BAKING
    • Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
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  • ASAP-1® IN SITU

    5-Axis CNC Mill for Selected Area Sample Preparation
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    • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
    • Adaptive 3D Mesh & Curve Mapping
    • Import Overlays – use X-RAY, C-SAM images to improve targeting
    • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
    • High-Def Digital Cameras — all native 4K (UHD)
    • Option for (up to) 32” Vision Monitor
    • Program by Touch, Mouse/Keyboard or REMOTELY
    Learn More Quote Select options

  • ASAP-1® IPS

    Digital Selected Area Preparation System
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    • Accurately decaps, thins & polishes
    • die, package, wafer and board-level
    • Live Process Video
    • Touchscreen with physical joystick & encoders
    • Full 100 x 100 mm Stage area
    • X, Y and Z axes all have deep sub-micron accuracy
    • Floating Head provides a true polishing action
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  • ULTRAPOL Advance

    Flat Lapping and Polishing Machine
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    • Better processing results –  ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
    • Fast & repeatable alignment  – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
    • Slurry polishing –  A recirculating pump may be added, in addition to the standard water coolant system. 
    • Avoids cross-contamination –  The unique slurry / drip tray concept allows convenient removal and cleaning
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  • ULTRAPOL End & Edge

    Flat And Angled Preparation Of Optical, Electronic & Materialographic Components
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    • Fully Angle adjustable – produces specific wedge angles
    • Quick Release Interface allow for fast and repeatable mounting and demounting.
    • Holders available for most components
    • Fast process times
    • Low run-out lap for flat optical polishes
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Our Decapsulation Products Include

  • ASAP-1® IN SITU

    5-Axis CNC Mill for Selected Area Sample Preparation
    , ,
    • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
    • Adaptive 3D Mesh & Curve Mapping
    • Import Overlays – use X-RAY, C-SAM images to improve targeting
    • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
    • High-Def Digital Cameras — all native 4K (UHD)
    • Option for (up to) 32” Vision Monitor
    • Program by Touch, Mouse/Keyboard or REMOTELY
    Learn More Quote Select options

  • ASAP-1® IPS

    Digital Selected Area Preparation System
    ,
    • Accurately decaps, thins & polishes
    • die, package, wafer and board-level
    • Live Process Video
    • Touchscreen with physical joystick & encoders
    • Full 100 x 100 mm Stage area
    • X, Y and Z axes all have deep sub-micron accuracy
    • Floating Head provides a true polishing action
    Learn More Quote Select options

  • Blue Mill

    Milling, Chip-off and IC Pre-Cavitation Machine
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    • Complete Solution – NO COMPUTER REQUIRED!
    • No programming or ‘G-Coding’ experience required
    • Great milling results for users of all experience levels
    • Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
    • Cold Chip-off for Digital Forensics of NAND Flash
    • Extremely Compact Footprint
    • For the budget conscious user who needs industry-proven results
    Learn More Quote Select options
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