ULTRA TEC Manufacturing, Inc. is pleased to introduce a new extended range of tools for its popular ASAP-1 Selected Area Preparation Product line, including both 8mm and 12mm diameter diamond tools for processing large dice and substrate surfaces. The move to a ‘one-piece’ design improves both concentricity and product consistency. Tools are available for the processing of the full range of ic devices — from surface mount packages of less than 0.5mm square, up to the largest programmable memory devices and server chips.
More details at www.ultratecusa.com