New TEC Note: A Straightforward Guide to the Preparation of Curved and Warped IC’s

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ULTRA TEC announces the publishing of a new TEC Note entitled ‘A Straightforward Guide to the Sample Preparation of Curved and Warped IC’s’. The publication describes techniques developed over many years to assist all users in achieving great backside thinned & polished samples for failure analysis.   

Much information has been written over recent years about how the rapid change in packaging technologies and how they have required 3D thinning and polishing to become a standard requirement.

This TEC NOTE brings together current information and provides sounds advice on how your lab can provide optimized samples for years to come.

Read TEC Note Now!