Text of Video… Welcome to ULTRA TEC’s Tools of the Trade presentation. ASAP-1 In Situ is our flagship precision milling and selected area preparation system for electronic failure analysis this year we are introducing features that further enhance backside thinning, decap, deprocessing, and cross-sectioning. Stage illumination has been improved with the system’s three standard ultra high definition cameras. These cameras …
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ULTRA TEC is pleased to announce that Engineering Consultant, Jim Colvin – working in part with his son, Christopher – has contributed two significant chapters to the recently published 7th Edition of ASM’s “Microelectronics Failure Analysis Desk Reference”. Long established as the touchstone for electronic FA professional, the new edition looks set to carry on this tradition. The publication is …
ULTRA TEC offers Cold Chip-off Equipment for Digital Forensics applications. See a video intro to our THIN BLUE (Product) Line by visiting here.
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A THANK YOU to the IPFA Organizers and to those who visited our virtual booth. We were proud to sponsor the event! We look forward to meeting everyone in person at the Physical Event in Singapore in 2022.
The EDFAS USER Group Series were held virtually in January 2021. ULTRA TEC was proud to sponsor the series of 4 informative and lively sessions for the Electronic FA Community.