Product And Company News

Top Surface Profile Scanning Now Available for improved Device Thinning & Precision Decap

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A new physical-contact Top Surface Scanning mode joins the feature set on ULTRA TEC’s ASAP-1 IN SITU Selected Area Prep System. Top Surface Scanning proves especially advantageous for when removing distinct successive material layers within semiconductor packages — such as multi-die stacks — where dies often need to be individually mapped to ensure resultant decapsulation success. Top Surface Scanning, moreover, …

Book Recommendation

tim Product And Company News, Technical Library

In “Failure Analysis: Who Needs It?”, George F. Gaut Jr. provides important insight to the Failure Analysis field that most books don’t do. FA uses many engineering disciplines to accomplish the desired result of making or keeping an operation or business successful.  Gaut’s book looks into the FA profession, the skill-set and analytical tools and techniques required and how FA might make sense …

Book Recommendation

tim Product And Company News, Technical Library

“Automated Methods in Cryptographic Fault Analysis” Edited by Jakub Breier, Xiaolu Hou, and Shivam Bhasin presents a collection of methods that are useful for different aspects of fault analysis in cryptography. ULTRA TEC’s ASAP-1 IPS is utilized for chip preparation of FPGA components to enable profiling with Laser Fault Inspection. Buy the book here

Interactive Graphics for IC Sample Prep

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ULTRA TEC Manufacturing Inc., Santa Ana, Calif., announces the availability of a greatly expanded software toolkit for its ASAP-1 In Situ 5-axis mill and selected area polishing station. The new software tools enable profiling and processing of curved and warped surfaces seen in the wide array of today’s packaged IC devices. These new adaptive techniques build on ASAP-1 In Situ’s unique built-in through-thickness …

ISTFA 2018 – Color Images – First Place Winner

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ULTRA TEC (Santa Ana, CA) are pleased to announce that 1st Place in the Color Images Category in the EDFAS 2018 Photo Competition was won by Tim Hazeldine, VP Sales & Marketing. —————- The image entitled “The Fire Inside” is shown below: “The Fire Inside — Visible light-illuminated view of a backside ultrathinned flip chip, showing emerging circuitry”. — ISTFA 2018 —— …

Extended Range of Tools for ASAP-1 Sample Preparation Products

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ULTRA TEC Manufacturing, Inc. is pleased to introduce a new extended range of tools for its popular ASAP-1 Selected Area Preparation Product line, including both 8mm and 12mm diameter diamond tools for processing large dice and substrate surfaces. The move to a ‘one-piece’ design improves both concentricity and product consistency. Tools are available for the processing of the full range …