5-Axis CNC Mill for Selected Area Sample Preparation


  • IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
  • Adaptive 3D Mesh & Curve Mapping
  • Import Overlays – use X-RAY, C-SAM images to improve targeting
  • Two RST Versions available-  NIR  (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
  • High-Def Digital Cameras — all native 4K (UHD)
  • Option for (up to) 32” Vision Monitor
  • Program by Touch, Mouse/Keyboard or REMOTELY
DIGITAL Selected Area Preparation System, 100-240V, 50/60Hz. Includes: X-Y table, tool spindle drive with deep sub-micron Z-resolution, +5/-5 degree automated tilt-table, touch-screen programming unit, integrated real-time machine vision, min 10-inch touchscreen lcd monitor, set of 2mm and 3mm tools, 6389.1 Force Feedback module. Mounting Position for optional 24" (min) Monitor. 4K Cameras (Target & Process)
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    • Adds sample curvature definition – Suits decapsulation, thinning, and polishing of packaged dice showing warpage or non-flat conditions. Independent X & Y Axis Correction, AUTOCURVE Mode. Also adds Stage AUTOTILT function
    • Adds thermal relaxation capability for warped die. Peltier-based heating plate with 1C accuracy. Hot Plate mode for convenient sample mount/demount. Includes stage, cable, two custom mounting plates with nylon retention screws -- as 6366.1 but adds Chiller unit and software to allow for faster cooling and overall enhanced system thermal stability
    • High impedance / small capacitance based -- Hardware and Software Upgrade to add end-pointing for enhancement of decap and de-processing
    • UT-F3 Thickness Reflectance Measurement System Offers single or multi-point non-contact measurement (1280-1340nm) of silicon and other semiconductor substrates – measures down to approx. 10 microns RST. Adds a third 4K (UHD) Camera mounted at the RST Position.
    • 2nd “VIS” Spectrometer added to the F3 system (requires UT-F3) to allow for measurements down to 10nm RST


5-Axis CNC Mill for Selected Area Sample Preparation

Based on many years of customer input and product development, ASAP-1® IN SITU is a single-footprint milling and sample prep system that can incorporate RST Measurement System –allowing measurement of the thickness of remaining silicon without sample transfer.
ASAP-1® IN SITU includes an entirely new OS, driven by a large touchscreen or mouse & keyboard (or even remotely), that allows for ultimate control of all process parameters — helping to ensure decap, thinning and/or polishing success.



A Powerful touchscreen OS ensures success in decap, thinning and polishing applications. 2 ultra-high definition cameras — Target (Straight-down), Process (45 degrees), and optional Microscope Cam — bring the ability to set, monitor and evaluate sample prep progress directly on the screen.


Note: ASAP-1®   is a Registered Trademark.   Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ;  6,781,232 & 7,066,788. 3 more Patent Pending.

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