ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample Preparation
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- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
Description
5-Axis CNC Mill for Selected Area Sample Preparation
A Powerful touchscreen OS ensures success in decap, thinning and polishing applications. 2 ultra-high definition cameras — Target (Straight-down), Process (45 degrees), and optional Microscope Cam — bring the ability to set, monitor and evaluate sample prep progress directly on the screen.
Note: ASAP-1® is a Registered Trademark. Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ; 6,781,232 & 7,066,788. 3 more Patent Pending.
Product Brochure
Related Consumables
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Crystal Wax
Mounting Compound- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
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Diamond Pastes
Pre-Polish AbrasivesDiamond Pastes are used for pre-polishing steps, and are particularly useful in the backside preparation of electronic dice.
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Extender Fluid
Vehicle For Diamond And Abrasive CompoundsExtender fluid is an excellent cutting, lapping and polishing vehicle.
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Loctite ‘404’
Mounting Compound- Strong, room temperature bonding
- Use with the reapplication of XYBOVE tips and several other applications
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ULTRAPOL Basic Chip-Off Package
For Digital Forensics Chip-Off- Includes Polisher, Long Arm, Sample Holder and Consumables
- Produce Excellent results, independent of operator skill level
- Affordable for all sizes of Lab
- Industry-Standard Equipment
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ASAP-1® IPS
Digital Selected Area Preparation System- 2nd Generation Unit (for 2024)
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
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ARC-lite
Antireflective Coating System For Backside Analysis- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
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ULTRASLICE
Versatile Precision Saw with Z-Spindle- Z-Spindle – Allows for cutting depth to be altered even during operation
- Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
- Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
- Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.
Related products
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CTC Polisher
Low Volume Bench-top Fiber Polisher- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Low to Medium Volume polishing of Connectors, termini and contacts.
- Cost-Effective Polishing – The use of 2 inch films on the machine make it extremely cost-effective
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FIBERTEC
Mass Production Fiber Polisher- LCD screen for storing up to nine different polishing recipes and process information
- Platen torque remains fixed even when speed is varied
- Air and water are kept separated inside of housing to ensure safe operation
- Adjustable weight allows for proper polishing force
- Anti-vibration feet allow for precise leveling – more concistent results
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NANOpol
Bare Fiber Beveling SystemNANOpol offers the fiber optic communications industry the ability to produce accurate polished bevels on bare optical fibers.
Angular control is achieved with the advanced positioning features of the integral micropositioned polishing head.
Designed for the price-conscious university and research environments, NANOpol uses a 4 inch diameter polishing lap – a size specially chosen for improved flatness/run-out and low consumables costs.
-
ULTRAPOL Basic Chip-Off Package
For Digital Forensics Chip-Off- Includes Polisher, Long Arm, Sample Holder and Consumables
- Produce Excellent results, independent of operator skill level
- Affordable for all sizes of Lab
- Industry-Standard Equipment