ASAP-1® IPS
Digital Selected Area Preparation System
Quote
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
Description
Digital Selected Area Preparation System
ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of die, package , module and wafer-level devices.
Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device-centric’ – designed to meet the non-destructive, high yield and survivability needs of electronic components.
IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides a unique ‘always-live’ image of the device, along with key navigational and process information.
Note: ASAP-1® is a Registered Trademark. Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ; 6,781,232 & 7,066,788. 3 more Patent Pending.
Product Brochure
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