ASAP-1® IPS

Digital Selected Area Preparation System

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  • 2nd Generation Unit (for 2024)
  • Accurately decaps, thins & polishes
  • die, package, wafer and board-level
  • 2 UHD Stage Cameras – front & side
  • Target Camera and overlay software options
  • Touchscreen with physical joystick & encoders
  • Full 100 x 100 mm Stage area
  • X, Y and Z axes all have deep sub-micron accuracy
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Description

Digital Selected Area Preparation System – 2nd Generation

ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of die, package, module and wafer-level devices. The new 2nd generation ASAP-1® IPS adds a suite of key feature upgrades.

Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic device sample preparation, IPS is ‘device-centric’ – designed to surpass the non-destructive, high yield and survivability results for labs analyzing micro-electronic components.

Machine vision cameras provide an unique ALWAYS-LIVE image of the device under test, along with key navigational and process controls. Auto head lift and lower, and optional fluid control system improves the user experience. IPS’ Touch Screen OS has been re-designed to control all aspects of the sample preparation process.

Now in its 2nd Generation, IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides a unique ‘always-live’ image of the device, along with key navigational and process information.

Note: ASAP-1®   is a Registered Trademark.   Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ;  6,781,232 & 7,066,788. 3 more Patent Pending.

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