ASAP-1® IPS
Digital Selected Area Preparation System
Quote
- Die, package, wafer and board-level
- Accurately decaps, thins & polishes
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- NIR led upgrade option
- MArket-leading Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
Description
Digital Selected Area Preparation System
ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of die, package, module and wafer-level devices. The upgraded 2nd generation ASAP-1® IPS adds a suite of key feature upgrades.
Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic device sample preparation, IPS is ‘device-centric’ – designed to surpass the non-destructive, high yield and survivability results for labs analyzing micro-electronic components.
Machine vision cameras provide an unique ALWAYS-LIVE image of the device under test, along with key navigational and process controls. Auto head lift and lower, and optional fluid control system improves the user experience. IPS’ Touch Screen OS has been re-designed to control all aspects of the sample preparation process.
Note: ASAP-1® is a Registered Trademark. Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ; 6,781,232 & 7,066,788. 3 more Patent Pending.
Product Brochure
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