ASAP-1® IPS
Digital Selected Area Preparation System
Quote
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
Description
Digital Selected Area Preparation System
ASAP-1® IPS is a digital sample preparation system for the decapsulation, thinning and polishing of die, package , module and wafer-level devices.
Drawing on ULTRA TEC’s market knowledge and long-standing leadership in electronic sample preparation, IPS is ‘device-centric’ – designed to meet the non-destructive, high yield and survivability needs of electronic components.
IPS’ Touch Screen OS has been designed from the ground-up to control all aspects of the sample preparation process. Advanced programming drives IPS’s deep sub-micron axes of motion. The machine vision monitor provides a unique ‘always-live’ image of the device, along with key navigational and process information.
Note: ASAP-1® is a Registered Trademark. Portions of the Technology are covered under US and related Worldwide patents – 6,630,369 ; 6,781,232 & 7,066,788. 3 more Patent Pending.
Product Brochure
Related Consumables
-
Crystal Wax
Mounting CompoundLearn More $80.00 Add to cart- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
-
Diamond Pastes
Pre-Polish AbrasivesLearn More $48.00 – $68.00 Select optionsDiamond Pastes are used for pre-polishing steps, and are particularly useful in the backside preparation of electronic dice.
-
Extender Fluid
Vehicle For Diamond And Abrasive CompoundsLearn More $19.00 Select optionsExtender fluid is an excellent cutting, lapping and polishing vehicle.
-
Loctite ‘404’
Mounting CompoundLearn More $56.00 Add to cart- Strong, room temperature bonding
- Use with the reapplication of XYBOVE tips and several other applications
Related products
-
ASAP-1®
Analog Selected Area Preparation SystemLearn More Quote Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
-
ULTRASLICE Macrotome
Low Cost Sectioning System For Mobile Chips, Devices & Industry SamplesLearn More $5,695.00 Select options- Suits Low Budgets
- Manual Crank Table Feed, with motor option
- Z-Spindle Option adds easy ability to adapt to sample height
- Chip-Off for Digital Forensics
- Fish & Game Samples
- Industrial Samples
-
ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic ComponentsLearn More Quote Select options- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
-
ULTRAPOL Basic Chip-Off Package
For Digital Forensics Chip-OffLearn More $3,442.00 – $6,995.00 Select options- Includes Polisher, Long Arm, Sample Holder and Consumables
- Produce Excellent results, independent of operator skill level
- Affordable for all sizes of Lab
- Industry-Standard Equipment
Related products
-
NANOpol
Bare Fiber Beveling SystemLearn More Quote Select optionsNANOpol offers the fiber optic communications industry the ability to produce accurate polished bevels on bare optical fibers.
Angular control is achieved with the advanced positioning features of the integral micropositioned polishing head.
Designed for the price-conscious university and research environments, NANOpol uses a 4 inch diameter polishing lap – a size specially chosen for improved flatness/run-out and low consumables costs.
-
ASAP-1®
Analog Selected Area Preparation SystemLearn More Quote Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
-
ULTRACOLLIMATOR
Sample Parallelism Alignment With LASER PrecisionLearn More Quote Select options- Works in conjunction with tilt controls to control sample alignment
- Improves alignment accuracy up to 20X
- Suits topside & backside electronic sample polishing
- Suits requirements for double sided polishing
-
ULTRAPOL Fiberlab Module System
Optical Fiber Lensing MachineLearn More Quote Select options- Fast Load & Unload
- Fast, Effective Polishing
- Wide Angular Range
- Digital Angle Readout Option
