Centering & Touch-Off Tools
$64.00 – $68.00
- For ASAP-1® Systems
- Rounded tip for tilt, curve and mesh measurement
- Pointed tip for centering verification
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ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More QUOTE Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
ASAP-1®
Analog Selected Area Preparation SystemLearn More QUOTE Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
Related products
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More QUOTE Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
ASAP-1®
Analog Selected Area Preparation SystemLearn More QUOTE Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.