Colloidal Silica
Chemo-Mechanical Final Polishing Solution
$28.00 – $237.00
- Used with Polishing Pads and Polyurethane surfaces
- Achieve a deep chemo-mechanical shine
Description
Chemo-mechanical Final polishing solution
Colloidal Silica is used to impart a final polish on a range of samples.
Specifications
ORDER CODE | DESCRIPTION | Micron Size (Approx.) | Unit Size |
---|---|---|---|
2394.1 | White Non-crystallizing Colloidal Silica | 0.04 | 1 gallon (3.8 l) |
2394.2 | White Non-crystallizing Colloidal Silica | 0.04 | 32 oz. (950 ml) |
2397.1 | Blue Non-crystallizing Colloidal Silica – for aggressive removal | 0.05 | 1 gallon (3.8 l) |
2397.2 | Blue Non-crystallizing Colloidal Silica – for aggressive removal | 0.05 | 32 oz. (950 ml) |
2395.1 | Ultrafine Non-crystallizing Colloidal Silica | 0.02 | 1 gallon (3.8 l) |
Related Consumables
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GammaSol Colloidal Alumina
Final Polishing Solution- Used with Polishing Pads
- Can work faster than colloidal silica
- Achieve a deep chemo-mechanical shine
-
Micro-Soap
Micro-Organic Critical Cleaning Of SamplesFor critical cleaning of samples when diluted in warm water – for example 2% Micro-Soap to 98% water.
Micro-soap works particularly well in the removal of colloidal silicas. Its efficacy is further improved with the use of an ULTRASONIC Cleaner.
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ULTRAPOL Advance
Flat Lapping and Polishing Machine- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
-
ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic Components- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
-
ASAP-1® IPS
Digital Selected Area Preparation System- 2nd Generation Unit (for 2024)
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
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ULTRAPOL Basic
Manual Lapping & Polishing Machine- Cost-effective manual polisher
- High Torque mechanism
- In-built coolant system
- Can be used with manual tools
- Upgradeable with Long Arm Positioner
- High Quality Build
Related products
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ULTRAPOL Basic
Manual Lapping & Polishing Machine- Cost-effective manual polisher
- High Torque mechanism
- In-built coolant system
- Can be used with manual tools
- Upgradeable with Long Arm Positioner
- High Quality Build
-
ULTRAPOL Advance
Flat Lapping and Polishing Machine- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
-
ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic Components- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
-
ASAP-1® IPS
Digital Selected Area Preparation System- 2nd Generation Unit (for 2024)
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy