ICis Microscope
Materials Inspection System
QUOTE
- Three Modes Available — NIR as Standard, with options for UV and high res visible
- Custom software includes imaging, image optimization,annotation, Silicon Thickness measurement, navigation and archival functions.
- Images topside x-section & backside electronic polished samples
- For validation of polished surface quality and for assessing de-processing position
Description
Materials Inspection System
ICis is a modular microscope offering up to 3 standard modes, often required by professionals in the electronics and related industries. The system is designed to be a primary tool for the engineer or technician working at a nearby polishing station. ICis allows for fast substrate thickness measurements of backside thinned and polished samples; it is also invaluable for fast imaging and archiving of die samples being parallel polished / de-processed.
The system accepts ULTRA TEC’s ASAP-1® sample mounting plates and ULTRAPOL Advance quick release sample holders.
Three Imaging Modes are available — NIR as standard, with options for UV and high res visible. The ICis’ Custom software includes imaging, image optimization, annotation, Silicon Thickness measurement, navigation and archival functions.
Key applications of ICis are in Imaging topside x-section & backside electronic polished samples. ICis is an invaluable tool for validation of polished surface quality and for assessing de-processing position.
UV– Highest Resolving Power. Bridges the gap between optical microscopy and SEMIntegrated Microscopy Suite with 3 Advanced Imaging
UV– Highest Resolving Power. Bridges the gap between optical microscopy and SEM
Product Brochure
Resolving Power Comparisons
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