Manual Planar Polishing Tool (UPF201)
- Great delayering results for a low cost
- Easy to use, easy to align
- Available with Teflon (maximum removal control) and Stainless Steel (maximum longevity) wear feet.
For Chip-Off and Device De-processing
A series of manual fixtures that allow for the planar grinding and polishing in a range of applications.
The sample or part to be prepared is mounted onto a metallic SEM-style stub with Crystal Wax. The stub fits into the UPF201 holder with an ingenious spring-loaded mounting mechanism, where it can be tilt-corrected for removal co-planarity with device circuity, pcb or package layers.
Manual Tools are available with either TEFLON (UPF201) wear pads — suited for semiconductor failure analysis, or Stainless Steel (UPF201S) wear feet — for ruggedized removal of pcb materials during mobile device chip-off.
UPF201S also forms part of the ULTRAPOL Basic Chip-off Package, where it integrates seamlessly the LONG ARM positioner for semi-automatic preparation.