Metal-Bond Blades – Low Concentration
For Precision Saws With 0.5 Inch Arbor(Spindle)
$218.00 – $243.00
- Range of o.d’s and thicknesses availble
- Suit many materials – silicon, ceramics, carbides, glasses
- other spindle (id) sizes and o.d.’s available — minimum purchase applies
Description
For Precision Saws with 0.5 inch arbor(spindle)
High quality standard blade for use with lower speeds and feeds, especially for brittle or hard materials such as silicon, ceramics, carbides, glasses and similar.
Related Consumables
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Crystal Wax
Mounting Compound- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
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Dresser Stick – Fine
For Re-Dressing Diamond BladesAllows for re-redressing of diamond blades, in case they become clogged with material.
Related products
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Micro-Soap
Micro-Organic Critical Cleaning Of SamplesFor critical cleaning of samples when diluted in warm water – for example 2% Micro-Soap to 98% water.
Micro-soap works particularly well in the removal of colloidal silicas. Its efficacy is further improved with the use of an ULTRASONIC Cleaner.
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Aquigrind
Water Soluble Cutting and Lapping Oil- General purpose water-based vehicle
- Helps achieve good sawed surface
- Suspends loose powder abrasives during lapping
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ULTRAPOL Diamond Laps – 8 Inch (203mm) dia.
Diamond Impregnated Surfaces For ULTRAPOL Machines- Two plates types – e-m and premium sintered
- Save on lapping films
- Choice of diamond size
- Range of material removal rates
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Loctite ‘404’
Mounting Compound- Strong, room temperature bonding
- Use with the reapplication of XYBOVE tips and several other applications
Related products
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Loctite ‘460’
Mounting Compound- ULTRA-Strong, room temperature bonding
- Pre-FIB, TEM and general applications requiring a strong semi-permanent bond
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Selected Area Preparation (SAP) Tools
For Use With ASAP-1® and Blue Mill SystemsSelect Tool Diameter (D)Price US$Step Generic Order Code (Replace .D with actual diam.) Tool Type Typical Application Example Image 0 5208. D Extra-coarse diamond Rapid Decap / ceramic 1 5210. D Coarse diamond Removing Package Materials 2 5215. D Milling Tool Copper Paddle Removal 2.5 5240. D Intermediate diamond Decap of interposer /die removal 3 5260. D Fine diamond Substrate thinning 3.5 5515. D Superfine diamond Substrate low damage thinning 3.9 5506. D Nanofine diamond Extremely low damage thinning-prepolish 4 & 5 5295. D XYLEM Initial Polish 6 5299. D XYBOVE Final Polish -
Diamond Pastes
Pre-Polish AbrasivesDiamond Pastes are used for pre-polishing steps, and are particularly useful in the backside preparation of electronic dice.
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Paraffin Wax
Mounting Compound- Softens at very low temperature — safe for most materials
- Weak bond
- Removed by pulling part out, or adding heat