Selected Area Preparation (SAP) Tools
For Use With ASAP-1® and Blue Mill Systems
$60.00 – $94.00
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Select Tool Diameter (D)
Price US$
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Step | Generic Order Code (Replace .D with actual diam.) | Tool Type | Typical Application | Example Image |
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0 | 5208. D | Extra-coarse diamond | Rapid Decap / ceramic |  |
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1 | 5210. D | Coarse diamond | Removing Package Materials |  |
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2 | 5215. D | Milling Tool | Copper Paddle Removal |  |
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2.5 | 5240. D | Intermediate diamond | Decap of interposer /die removal |  |
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3 | 5260. D | Fine diamond | Substrate thinning |  |
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3.5 | 5515. D | Superfine diamond | Substrate low damage thinning |  |
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3.9 | 5506. D | Nanofine diamond | Extremely low damage thinning-prepolish | |
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4 & 5 | 5295. D | XYLEM | Initial Polish |  |
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6 | 5299. D | XYBOVE | Final Polish |  |
Description
| Tool Diameter (D) | Cavity / Die Size Range (X or Y) |
|---|---|
| 0.2 mm | 0.3 to 0.5 mm |
| 0.4 mm | 0.5 to 0.9 mm |
| 0.7 mm | 0.9 to 2 mm |
| 1 mm | 1.5 to 5 mm |
| 2 mm | 4 to 9 mm |
| 3 mm | 8 to 15 mm |
| 5 mm | 15 to 25 mm |
| 8 mm | 20 to 38 mm |
| 12 mm | Large Areas / De-processing |
| Custom Size | Ask for details |
Note: Tool Longevity – Approx. # cycles/tool have been determined empirically. Actual longevity of each tool depends on many factors and will vary.
| Step | Suggested Lubricant | Avg. Tool Life (# parts/tool) |
|---|---|---|
| 0 | Water or extender | 30+ on plastics, 1-3 on ceramics |
| 1 | Water or extender | 30 |
| 2 | Extender | 8 |
| 2.5 | Water or extender | 10 |
| 3 | Water or extender | 15 |
| 3.5 | Water or extender | 8 |
| 3.7 | Water or extender | 5 |
| 3.9 | Water or extender | 5 |
| 4 & 5 | Extender + diamond paste | 30 |
| 6 | Colloidal Silica | 6 |
Related products
-
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More Quote Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
Related products
-
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More Quote Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action