Selected Area Preparation (SAP) Tools
For Use With ASAP-1® and Blue Mill Systems
$60.00 – $114.00
2699
Select Tool Diameter (D)
Price US$
|
Step | Generic Order Code (Replace .D with actual diam.) | Tool Type | Typical Application | Example Image |
---|---|---|---|---|---|
|
0 | 5208. D | Extra-coarse diamond | Rapid Decap / ceramic | ![]() |
|
1 | 5210. D | Coarse diamond | Removing Package Materials | ![]() |
|
2 | 5215. D | Milling Tool | Copper Paddle Removal | ![]() |
|
2.5 | 5240. D | Intermediate diamond | Decap of interposer /die removal | ![]() |
|
3 | 5260. D | Fine diamond | Substrate thinning | ![]() |
|
3.5 | 5515. D | Superfine diamond | Substrate low damage thinning | ![]() |
|
3.9 | 5506. D | Nanofine diamond | Extremely low damage thinning-prepolish | ![]() |
|
4 & 5 | 5295. D | XYLEM | Initial Polish | ![]() |
|
6 | 5299. D | XYBOVE | Final Polish | ![]() |
Description
Tool Diameter (D) | Cavity / Die Size Range (X or Y) |
---|---|
0.2 mm | 0.3 to 0.5 mm |
0.4 mm | 0.5 to 0.9 mm |
0.7 mm | 0.9 to 2 mm |
1 mm | 1.5 to 5 mm |
2 mm | 4 to 9 mm |
3 mm | 8 to 15 mm |
5 mm | 15 to 25 mm |
8 mm | 20 to 38 mm |
12 mm | Large Areas / De-processing |
Custom Size | Ask for details |
Note: Tool Longevity – Approx. # cycles/tool have been determined empirically. Actual longevity of each tool depends on many factors and will vary.
Step | Suggested Lubricant | Avg. Tool Life (# parts/tool) |
---|---|---|
0 | Water or extender | 30+ on plastics, 1-3 on ceramics |
1 | Water or extender | 30 |
2 | Extender | 8 |
2.5 | Water or extender | 10 |
3 | Water or extender | 15 |
3.5 | Water or extender | 8 |
3.7 | Water or extender | 5 |
3.9 | Water or extender | 5 |
4 & 5 | Extender + diamond paste | 30 |
6 | Colloidal Silica | 6 |
Related products
-
ASAP-1® IPS
Digital Selected Area Preparation System- 2nd Generation Unit (for 2024)
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
Related products
-
ASAP-1® IPS
Digital Selected Area Preparation System- 2nd Generation Unit (for 2024)
- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- 2 UHD Stage Cameras – front & side
- Target Camera and overlay software options
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy