ULTRAPOL Advance
Flat Lapping and Polishing Machine
QUOTE
- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
Description
ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s.
Key applications of the technology include:
Topside electronic de-processing – enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR.
Topside delayered IC showing no edge-rounding
Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces.
Cross-sectioning of die and package-level devices.
Along with ULTRA TEC’s signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.
Fast and convenient sample movement between polisher & microscope, coupled with the option of ULTRACOLLIMATOR optical alignment system, provides reference to the die — a huge improvement over earlier generation polishers.
ULTRAPOL Advance enables recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a ‘Power polish’ mode is incorporated that rotates the sample during processing.
PRODUCT BROCHURE
Related Consumables
Crystal Wax
Mounting CompoundLearn More $80.00 Add to cart- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
GammaSol Colloidal Alumina
Final Polishing SolutionLearn More $36.00 – $442.00 Select options- Used with Polishing Pads
- Can work faster than colloidal silica
- Achieve a deep chemo-mechanical shine
Lapping & Polishing Films – 8 inch (203mm) diameter
Learn More $138.00 – $248.00 Select options- Premium Quality Lapping Films
- Wide range of films in diamond, aluminum oxide and silicon carbide
- Available with and without adhesive-backing (PSA)
DIAMOND 8” Adhesive-backed
Order No. Micron Size Pack Qty Pack Price Add To Cart M.8230.1 0.1 5 $168. M.8231.1 0.5 5 $168. M.8232.1 1 5 $168. M.8233.1 3 5 $168. M.8237.1 6 5 $168. M.8235.1 9 5 $168. M.8236.1 15 5 $168. M.8238.1 30 5 $188. DIAMOND 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8430.1 0.1 5 $138.00 M.8431.1 0.5 5 $138.00 M.8432.1 1 5 $138.00 M.8433.1 3 5 $138.00 M.8437.1 6 5 $138.00 M.8435.1 9 5 $138.00 M.8436.1 15 5 $138.00 M.8438.1 30 5 $148.00 SILICON CARBIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8221.1 1 100 $198. M.8222.1 3 100 $198. M.8223.1 5 100 $198. M.8224.1 9 100 $198. M.8225.1 12 100 $198. M.8226.1 16 100 $198. M.8228.1 30 100 $218. SILICON CARBIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8421.1 1 100 $169.00 M.8422.1 3 100 $169.00 M.8423.1 5 100 $169.00 M.8424.1 9 100 $169.00 M.8425.1 12 100 $169.00 M.8426.1 16 100 $169.00 M.8428.1 30 100 $169.00 ALUMINUM OXIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8211.1 0.3 100 $198. M.8229.1 0.5 100 $198. M.8212.1 1 100 $198. M.8214.1 3 100 $198. M.8215.1 5 100 $198. M.8216.1 9 100 $198. M.8217.1 12 100 $198. M.8218.1 16 100 $198. M.8220.1 30 100 $218. M.8250.1 ULTRAFILM B 100 $248. ALUMINUM OXIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8411.1 0.3 100 $148 M.8429.1 0.5 100 $148 M.8412.1 1 100 $148 M.8414.1 3 100 $148 M.8415.1 5 100 $148 M.8416.1 9 100 $148 M.8417.1 12 100 $148 M.8418.1 16 100 $148 M.8420.1 30 100 $168 M.8450.1 ULTRAFILM B 100 $218 ULTRAPOL B
Order No. Micron Size Pack Price Add To Cart 1528.4 ULTRAPOL B suspension (4 oz. Bottle) $81 1528.9 ULTRAPOL B suspension (1 gallon) $945 
ULTRAPOL Diamond Laps – 8 Inch (203mm) dia.
Diamond Impregnated Surfaces For ULTRAPOL MachinesLearn More $560.00 – $939.00 Select options- Two plates types – e-m and premium sintered
- Save on lapping films
- Choice of diamond size
- Range of material removal rates
ULTRAPOL Lapping & Polishing Surfaces – 8 inch (203mm) dia.
A Range Of Surfaces For Various MaterialsLearn More $278.00 – $689.00 Select options- Range of laps
- used with slurries and/or loose abrasives
- Fit all 8″ lap diameter ULTRAPOL systems
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ULTRAPOL FIBERLAB Microscope
QA And Measurement Station For Fiber Lensing With Optional On-Line CameraLearn More QUOTE Select options- Accepts ULTRAPOL Quick Release Fiber Lensing Fixtures
- USB Camera(s)
- QA availability for improving polishing yields and results
- Advanced Suite of Angular and length measurement characteristics in software
ICis Microscope
Materials Inspection SystemLearn More QUOTE Select options- Three Modes Available — NIR as Standard, with options for UV and high res visible
- Custom software includes imaging, image optimization,annotation, Silicon Thickness measurement, navigation and archival functions.
- Images topside x-section & backside electronic polished samples
- For validation of polished surface quality and for assessing de-processing position
ULTRASLICE
Versatile Precision Saw with Z-SpindleLearn More QUOTE Select options- Z-Spindle – Allows for cutting depth to be altered even during operation
- Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
- Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
- Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.
ULTRASPEC-III
3 Wavelength Laser IlluminatorLearn More QUOTE Select options- Improved imaging and contrast
- Three laser lines can be used independently or blended – 670nm, 1064nm and 1300nm
- Suits most backside microscopes
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, probing, and most other backside techniques
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ULTRAPOL Fiberlab Module System
Optical Fiber Lensing MachineLearn More QUOTE Select options- Fast Load & Unload
- Fast, Effective Polishing
- Wide Angular Range
- Digital Angle Readout Option
FTTx Polisher
Portable Fiber PolisherLearn More $4,023.00 – $5,748.00 Select options- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Use anywhere – true portable machine, with battery power
- Bench-top stand – converts polisher for small production use in the factory
ASAP-1®
Analog Selected Area Preparation SystemLearn More QUOTE Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
ULTRASLICE Macrotome
Low Cost Sectioning System For Mobile Chips & DevicesLearn More $4,995.00 Select options- Suits Low Budgets
- Z-Spindle is standard
- Manual Crank Table Feed, with motor option
- Chip-Off for Digital Forensics
- Fish & Game
- Industrial Samples
