ULTRAPOL Advance
Flat Lapping and Polishing Machine
Quote
- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
Description
ULTRAPOL Advance has been designed to be an all-in-one lapping & polishing workstation for the production of flat surfaces. Advance’s unbeatable combination of advanced control and process features allow for the accurate processing of modern generations of IC’s.
Key applications of the technology include:
Topside electronic de-processing – enabled by the advanced angular control and optical enhancements such as ULTRACOLLIMATOR.
Topside delayered IC showing no edge-rounding
Backside preparation of packages and wafers, particularly for flip-chips – and rapid global thinning of larger surfaces.
Cross-sectioning of die and package-level devices.
Along with ULTRA TEC’s signature Quick Release interface and workholder technologies, ULTRAPOL Advance offers completely new designs for sample loading, oscillation and tilt alignment.
Fast and convenient sample movement between polisher & microscope, coupled with the option of ULTRACOLLIMATOR optical alignment system, provides reference to the die — a huge improvement over earlier generation polishers.
ULTRAPOL Advance enables recirculating slurry polishing (key for many delayering operations) as well as standard faucet coolant. For aggressive material removal operations (such as the back-thinning of larger flip chips), a ‘Power polish’ mode is incorporated that rotates the sample during processing.
PRODUCT BROCHURE
Related Consumables
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Crystal Wax
Mounting Compound- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
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GammaSol Colloidal Alumina
Final Polishing Solution- Used with Polishing Pads
- Can work faster than colloidal silica
- Achieve a deep chemo-mechanical shine
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Lapping & Polishing Films – 8 inch (203mm) diameter
- Premium Quality Lapping Films
- Wide range of films in diamond, aluminum oxide and silicon carbide
- Available with and without adhesive-backing (PSA)
DIAMOND 8” Adhesive-backed
Order No. Micron Size Pack Qty Pack Price Add To Cart M.8230.1 0.1 5 $180 M.8231.1 0.5 5 $180 M.8232.1 1 5 $180 M.8233.1 3 5 $180 M.8237.1 6 5 $180 M.8235.1 9 5 $180 M.8236.1 15 5 $180 M.8238.1 30 5 $200 DIAMOND 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8430.1 0.1 5 $150 M.8431.1 0.5 5 $150 M.8432.1 1 5 $150 M.8433.1 3 5 $150 M.8437.1 6 5 $150 M.8435.1 9 5 $150 M.8436.1 15 5 $150 M.8438.1 30 5 $160 SILICON CARBIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8221.1 1 100 $198. M.8222.1 3 100 $198. M.8223.1 5 100 $198. M.8224.1 9 100 $198. M.8225.1 12 100 $198. M.8226.1 16 100 $198. M.8228.1 30 100 $218. SILICON CARBIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8421.1 1 100 $169.00 M.8422.1 3 100 $169.00 M.8423.1 5 100 $169.00 M.8424.1 9 100 $169.00 M.8425.1 12 100 $169.00 M.8426.1 16 100 $169.00 M.8428.1 30 100 $169.00 ALUMINUM OXIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8211.1 0.3 100 $198. M.8229.1 0.5 100 $198. M.8212.1 1 100 $198. M.8214.1 3 100 $198. M.8215.1 5 100 $198. M.8216.1 9 100 $198. M.8217.1 12 100 $198. M.8218.1 16 100 $198. M.8220.1 30 100 $218. M.8250.1 ULTRAFILM B 100 $248. ALUMINUM OXIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8411.1 0.3 100 $148 M.8429.1 0.5 100 $148 M.8412.1 1 100 $148 M.8414.1 3 100 $148 M.8415.1 5 100 $148 M.8416.1 9 100 $148 M.8417.1 12 100 $148 M.8418.1 16 100 $148 M.8420.1 30 100 $168 M.8450.1 ULTRAFILM B 100 $218 ULTRAPOL B
Order No. Micron Size Pack Price Add To Cart 1528.4 ULTRAPOL B suspension (4 oz. Bottle) $81 1528.9 ULTRAPOL B suspension (1 gallon) $945
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ULTRAPOL Diamond Laps – 8 Inch (203mm) dia.
Diamond Impregnated Surfaces For ULTRAPOL Machines- Two plates types – e-m and premium sintered
- Save on lapping films
- Choice of diamond size
- Range of material removal rates
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NANOpol
Bare Fiber Beveling SystemNANOpol offers the fiber optic communications industry the ability to produce accurate polished bevels on bare optical fibers.
Angular control is achieved with the advanced positioning features of the integral micropositioned polishing head.
Designed for the price-conscious university and research environments, NANOpol uses a 4 inch diameter polishing lap – a size specially chosen for improved flatness/run-out and low consumables costs.
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ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample Preparation- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
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ULTRASLICE
Versatile Precision Saw with Z-Spindle- Z-Spindle – Allows for cutting depth to be altered even during operation
- Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
- Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
- Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.
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ULTRASLICE Macrotome
Low Cost Sectioning System For Mobile Chips, Devices & Industry Samples- Suits Low Budgets
- Manual Crank Table Feed, with motor option
- Z-Spindle Option adds easy ability to adapt to sample height
- Chip-Off for Digital Forensics
- Fish & Game Samples
- Industrial Samples
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ULTRAPOL Manual Station
For Convenient, Practical Polishing Lab Management- Low cost
- Provides a convenient station for the workday’s polishing activities
- Films, fluids and surfaces can be kept moist overnight with the optional lid
- Entirely manual – DOES NOT have a motor
-
ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample Preparation- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
-
ULTRACOLLIMATOR
Sample Parallelism Alignment With LASER Precision- Works in conjunction with tilt controls to control sample alignment
- Improves alignment accuracy up to 20X
- Suits topside & backside electronic sample polishing
- Suits requirements for double sided polishing
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ULTRASLICE
Versatile Precision Saw with Z-Spindle- Z-Spindle – Allows for cutting depth to be altered even during operation
- Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
- Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
- Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.