ULTRAPOL Basic Chip-Off Package
For Digital Forensics Chip-Off
$3,442.00 – $6,995.00
- Includes Polisher, Long Arm, Sample Holder and Consumables
- Produce Excellent results, independent of operator skill level
- Affordable for all sizes of Lab
- Industry-Standard Equipment
Description
For Digital Forensics Chip-Off
The gathering and maintenance of data evidence is the overriding requirement for law enforcement professionals engaged in Digital Forensics. Mobile devices provide information (texts, emails, phone calls, GPS) relative to a crime suspect’s whereabouts and communications provide important evidence for an investigation.
Chip-Off is an important technique for digital forensics labs that need to access data from mobile devices, such as cellphones and tablet computers. Older thermal techniques, using a heat-gun and a tweezer, have low yields and can lead to an unacceptable loss of data. ULTRA TEC has developed a range of mechanical machinery (precision sawing, milling and flat grinding) that keep process temperatures low and can prepare NAND Flash devices from all directions — leading to consistency between users, and the highest yield — with maintenance of crucial data.
We are pleased to offer you cost-effective sample prep equipment with the minimum requirements for spare parts and ongoing maintenance – no nasty pricing ‘surprises’ down the road!
Further Reading: “Seeking the Truth from Mobile Evidence” by John Bair, 1st Edition. Chapter 27
PRODUCT BROCHURE
Related Consumables
-
Crystal Wax
Mounting CompoundLearn More $80.00 Add to cart- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
-
Lapping & Polishing Films – 8 inch (203mm) diameter
Learn More $138.00 – $248.00 Select options- Premium Quality Lapping Films
- Wide range of films in diamond, aluminum oxide and silicon carbide
- Available with and without adhesive-backing (PSA)
DIAMOND 8” Adhesive-backed
Order No. Micron Size Pack Qty Pack Price Add To Cart M.8230.1 0.1 5 $168. M.8231.1 0.5 5 $168. M.8232.1 1 5 $168. M.8233.1 3 5 $168. M.8237.1 6 5 $168. M.8235.1 9 5 $168. M.8236.1 15 5 $168. M.8238.1 30 5 $188. DIAMOND 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8430.1 0.1 5 $138.00 M.8431.1 0.5 5 $138.00 M.8432.1 1 5 $138.00 M.8433.1 3 5 $138.00 M.8437.1 6 5 $138.00 M.8435.1 9 5 $138.00 M.8436.1 15 5 $138.00 M.8438.1 30 5 $148.00 SILICON CARBIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8221.1 1 100 $198. M.8222.1 3 100 $198. M.8223.1 5 100 $198. M.8224.1 9 100 $198. M.8225.1 12 100 $198. M.8226.1 16 100 $198. M.8228.1 30 100 $218. SILICON CARBIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8421.1 1 100 $169.00 M.8422.1 3 100 $169.00 M.8423.1 5 100 $169.00 M.8424.1 9 100 $169.00 M.8425.1 12 100 $169.00 M.8426.1 16 100 $169.00 M.8428.1 30 100 $169.00 ALUMINUM OXIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8211.1 0.3 100 $198. M.8229.1 0.5 100 $198. M.8212.1 1 100 $198. M.8214.1 3 100 $198. M.8215.1 5 100 $198. M.8216.1 9 100 $198. M.8217.1 12 100 $198. M.8218.1 16 100 $198. M.8220.1 30 100 $218. M.8250.1 ULTRAFILM B 100 $248. ALUMINUM OXIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8411.1 0.3 100 $148 M.8429.1 0.5 100 $148 M.8412.1 1 100 $148 M.8414.1 3 100 $148 M.8415.1 5 100 $148 M.8416.1 9 100 $148 M.8417.1 12 100 $148 M.8418.1 16 100 $148 M.8420.1 30 100 $168 M.8450.1 ULTRAFILM B 100 $218 ULTRAPOL B
Order No. Micron Size Pack Price Add To Cart 1528.4 ULTRAPOL B suspension (4 oz. Bottle) $81 1528.9 ULTRAPOL B suspension (1 gallon) $945
-
ULTRAPOL Lapping & Polishing Surfaces – 8 inch (203mm) dia.
A Range Of Surfaces For Various MaterialsLearn More $278.00 – $689.00 Select options- Range of laps
- used with slurries and/or loose abrasives
- Fit all 8″ lap diameter ULTRAPOL systems
Related products
-
ASAP-1®
Analog Selected Area Preparation SystemLearn More Quote Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
-
Height Indicators
Fast, Accurate Drop-Down GaugesLearn More $742.00 – $1,806.00 Select options- Choice of Accuracy
- Digital and Analog versions
- Granite bases available in other sizes for custom requirements
-
ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample PreparationLearn More Quote Select options- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
-
Blue Mill
Milling, Chip-off and IC Pre-Cavitation MachineLearn More Quote Select options- Complete Solution – NO COMPUTER REQUIRED!
- No programming or ‘G-Coding’ experience required
- Great milling results for users of all experience levels
- Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
- Cold Chip-off for Digital Forensics of NAND Flash
- Extremely Compact Footprint
- For the budget conscious user who needs industry-proven results
Related products
-
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More Quote Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
-
ULTRAPOL Basic
Manual Lapping & Polishing MachineLearn More $3,958.00 Select options- Cost-effective manual polisher
- High Torque mechanism
- In-built coolant system
- Can be used with manual tools
- Upgradeable with Long Arm Positioner
- High Quality Build
-
ULTRAPOL Advance
Flat Lapping and Polishing MachineLearn More Quote Select options- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
-
ASAP-1®
Analog Selected Area Preparation SystemLearn More Quote Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
