ULTRAPOL Basic
Manual Lapping & Polishing Machine
$3,958.00
- Cost-effective manual polisher
- High Torque mechanism
- In-built coolant system
- Can be used with manual tools
- Upgradeable with Long Arm Positioner
- High Quality Build
Description
ULTRAPOL Basic lapping and polishing machine offers the build-quality required for high precision manual polishing of materials for production, research and NAND flash chip-off in digital forensics — at an extremely affordable price.
The system has an 8 inch, replaceable polishing plate, faucet coolant, and dual lap direction.
A key upgrade to the unit is the Long Arm Positioner, which holds a range of our manual polishing tools.
Several specialist manual polishing tools are available for the system:
UPF201 – Planar polishing tool for Chip-Off and bare die thinning and de-processing
UPF101- Cross-sectioning tool for semiconductor die
ULTRATOOL – for fiber optic and small optics polishing.
PRODUCT BROCHURE
Related Consumables
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Crystal Wax
Mounting Compound- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
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GammaSol Colloidal Alumina
Final Polishing Solution- Used with Polishing Pads
- Can work faster than colloidal silica
- Achieve a deep chemo-mechanical shine
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Lapping & Polishing Films – 8 inch (203mm) diameter
- Premium Quality Lapping Films
- Wide range of films in diamond, aluminum oxide and silicon carbide
- Available with and without adhesive-backing (PSA)
DIAMOND 8” Adhesive-backed
Order No. Micron Size Pack Qty Pack Price Add To Cart M.8230.1 0.1 5 $180 M.8231.1 0.5 5 $180 M.8232.1 1 5 $180 M.8233.1 3 5 $180 M.8237.1 6 5 $180 M.8235.1 9 5 $180 M.8236.1 15 5 $180 M.8238.1 30 5 $200 DIAMOND 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8430.1 0.1 5 $150 M.8431.1 0.5 5 $150 M.8432.1 1 5 $150 M.8433.1 3 5 $150 M.8437.1 6 5 $150 M.8435.1 9 5 $150 M.8436.1 15 5 $150 M.8438.1 30 5 $160 SILICON CARBIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8221.1 1 100 $198. M.8222.1 3 100 $198. M.8223.1 5 100 $198. M.8224.1 9 100 $198. M.8225.1 12 100 $198. M.8226.1 16 100 $198. M.8228.1 30 100 $218. SILICON CARBIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8421.1 1 100 $169.00 M.8422.1 3 100 $169.00 M.8423.1 5 100 $169.00 M.8424.1 9 100 $169.00 M.8425.1 12 100 $169.00 M.8426.1 16 100 $169.00 M.8428.1 30 100 $169.00 ALUMINUM OXIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8211.1 0.3 100 $198. M.8229.1 0.5 100 $198. M.8212.1 1 100 $198. M.8214.1 3 100 $198. M.8215.1 5 100 $198. M.8216.1 9 100 $198. M.8217.1 12 100 $198. M.8218.1 16 100 $198. M.8220.1 30 100 $218. M.8250.1 ULTRAFILM B 100 $248. ALUMINUM OXIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8411.1 0.3 100 $148 M.8429.1 0.5 100 $148 M.8412.1 1 100 $148 M.8414.1 3 100 $148 M.8415.1 5 100 $148 M.8416.1 9 100 $148 M.8417.1 12 100 $148 M.8418.1 16 100 $148 M.8420.1 30 100 $168 M.8450.1 ULTRAFILM B 100 $218 ULTRAPOL B
Order No. Micron Size Pack Price Add To Cart 1528.4 ULTRAPOL B suspension (4 oz. Bottle) $81 1528.9 ULTRAPOL B suspension (1 gallon) $945
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ULTRAPOL B Suspension
Final Polish Solution- Used with ULTRAFILM B
- Combination of film and suspension achieves a deep shine
- Convenient to use
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ULTRAPOL Diamond Laps – 8 Inch (203mm) dia.
Diamond Impregnated Surfaces For ULTRAPOL Machines- Two plates types – e-m and premium sintered
- Save on lapping films
- Choice of diamond size
- Range of material removal rates
Related products
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ULTRASPEC-III
3 Wavelength Laser Illuminator- Improved imaging and contrast
- Three laser lines can be used independently or blended – 670nm, 1064nm and 1300nm
- Suits most backside microscopes
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, probing, and most other backside techniques
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ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic Components- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
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ULTRAPOL Manual Station
For Convenient, Practical Polishing Lab Management- Low cost
- Provides a convenient station for the workday’s polishing activities
- Films, fluids and surfaces can be kept moist overnight with the optional lid
- Entirely manual – DOES NOT have a motor
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UT.MINIPOL.1 Single-Position Polisher
Single Position Fiber Polisher- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Wide range of holders
- Low Cost machinery solution
Related products
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ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample Preparation- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
-
ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic Components- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
-
ULTRAPOL FIBERLAB Microscope
QA And Measurement Station For Fiber Lensing With Optional On-Line Camera- Accepts ULTRAPOL Quick Release Fiber Lensing Fixtures
- USB Camera(s)
- QA availability for improving polishing yields and results
- Advanced Suite of Angular and length measurement characteristics in software
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ARC-lite
Antireflective Coating System For Backside Analysis- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques