ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic Components
Quote
- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
Description
ULTRAPOL End & Edge Polisher has been designed to provide accurate lapping and polishing for research and industrial applcations. Several thousand of these units are already assisting users in a wide range of technical disciplines.
Key to the high quality performance of the unit is the calibration of the polishing base and the advanced angular control provided by the polishing head. Units with wither Digital or Analog Polishing Angle Read-outs are available.
Built-in features such as tachometer, process end-indicator, timer, and head oscillation provide assurance the finest surface production. The unit also features a solenoid controlled coolant system.
The specific workholder for an application is held firmly and repeatably with the system’s quick release interface. Standard holders are available for many applications, including:
- Capillary / glass ferrule polishing
- Planar Waveguide polishing
- Bare fiber polishing – flat and angle polishing
- Integrated optics
- Die Cross-sectioning
- SEM and TEM sample preparation
- IC Wafer and package-level backside preparation
- Encapsulated mount polishing
Custom workholders can also be designed to your specific needs. ULTRAPOL End & Edge Polisher uses 8 inch diameter films, pads, papers and surfaces that are easily changed.
PRODUCT BROCHURE
Related Consumables
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Crystal Wax
Mounting Compound- Softens at 71°C (160°F) for easy mounting
- Strong bond
- Removed completely with Acetone
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GammaSol Colloidal Alumina
Final Polishing Solution- Used with Polishing Pads
- Can work faster than colloidal silica
- Achieve a deep chemo-mechanical shine
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Lapping & Polishing Films – 8 inch (203mm) diameter
- Premium Quality Lapping Films
- Wide range of films in diamond, aluminum oxide and silicon carbide
- Available with and without adhesive-backing (PSA)
DIAMOND 8” Adhesive-backed
Order No. Micron Size Pack Qty Pack Price Add To Cart M.8230.1 0.1 5 $180 M.8231.1 0.5 5 $180 M.8232.1 1 5 $180 M.8233.1 3 5 $180 M.8237.1 6 5 $180 M.8235.1 9 5 $180 M.8236.1 15 5 $180 M.8238.1 30 5 $200 DIAMOND 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8430.1 0.1 5 $150 M.8431.1 0.5 5 $150 M.8432.1 1 5 $150 M.8433.1 3 5 $150 M.8437.1 6 5 $150 M.8435.1 9 5 $150 M.8436.1 15 5 $150 M.8438.1 30 5 $160 SILICON CARBIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8221.1 1 100 $198. M.8222.1 3 100 $198. M.8223.1 5 100 $198. M.8224.1 9 100 $198. M.8225.1 12 100 $198. M.8226.1 16 100 $198. M.8228.1 30 100 $218. SILICON CARBIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8421.1 1 100 $169.00 M.8422.1 3 100 $169.00 M.8423.1 5 100 $169.00 M.8424.1 9 100 $169.00 M.8425.1 12 100 $169.00 M.8426.1 16 100 $169.00 M.8428.1 30 100 $169.00 ALUMINUM OXIDE 8” Adhesive-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8211.1 0.3 100 $198. M.8229.1 0.5 100 $198. M.8212.1 1 100 $198. M.8214.1 3 100 $198. M.8215.1 5 100 $198. M.8216.1 9 100 $198. M.8217.1 12 100 $198. M.8218.1 16 100 $198. M.8220.1 30 100 $218. M.8250.1 ULTRAFILM B 100 $248. ALUMINUM OXIDE 8” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.8411.1 0.3 100 $148 M.8429.1 0.5 100 $148 M.8412.1 1 100 $148 M.8414.1 3 100 $148 M.8415.1 5 100 $148 M.8416.1 9 100 $148 M.8417.1 12 100 $148 M.8418.1 16 100 $148 M.8420.1 30 100 $168 M.8450.1 ULTRAFILM B 100 $218 ULTRAPOL B
Order No. Micron Size Pack Price Add To Cart 1528.4 ULTRAPOL B suspension (4 oz. Bottle) $81 1528.9 ULTRAPOL B suspension (1 gallon) $945
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ULTRAPOL B Suspension
Final Polish Solution- Used with ULTRAFILM B
- Combination of film and suspension achieves a deep shine
- Convenient to use
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ULTRAPOL Diamond Laps – 8 Inch (203mm) dia.
Diamond Impregnated Surfaces For ULTRAPOL Machines- Two plates types – e-m and premium sintered
- Save on lapping films
- Choice of diamond size
- Range of material removal rates
Specification
Angular accuracy | 0.1 degrees | |
Angular Range | 0 to 12 degrees | |
Footprint | 22 inches (55 cm) wide x 12 inches (30 cm) deep x 19 Inches (48 cm) high | |
System Weight | 27 kg (60 lbs) |
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ASAP-1® IPS
Digital Selected Area Preparation System- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
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ULTRASLICE
Versatile Precision Saw with Z-Spindle- Z-Spindle – Allows for cutting depth to be altered even during operation
- Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
- Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
- Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.
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ULTRASLICE Compact
Versatile Precision Saw for Small workspaces & small budgets- Versatility – The system handles samples of most shapes, sizes and orientations.
- Cutting Accuracy – precision lead screws on all feed directions
- Long Cuts & Dicing – A large work-table and ‘open’ system design allows for longitudinal sectioning and dicing
- Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – a wide range of diamond and abrasive blades is available.
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ARC-lite
Antireflective Coating System For Backside Analysis- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
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ULTRAPOL Fiberlab Module System
Optical Fiber Lensing Machine- Fast Load & Unload
- Fast, Effective Polishing
- Wide Angular Range
- Digital Angle Readout Option
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ULTRAPOL Manual Station
For Convenient, Practical Polishing Lab Management- Low cost
- Provides a convenient station for the workday’s polishing activities
- Films, fluids and surfaces can be kept moist overnight with the optional lid
- Entirely manual – DOES NOT have a motor
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NANOpol
Bare Fiber Beveling SystemNANOpol offers the fiber optic communications industry the ability to produce accurate polished bevels on bare optical fibers.
Angular control is achieved with the advanced positioning features of the integral micropositioned polishing head.
Designed for the price-conscious university and research environments, NANOpol uses a 4 inch diameter polishing lap – a size specially chosen for improved flatness/run-out and low consumables costs.
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Height Indicators
Fast, Accurate Drop-Down Gauges- Choice of Accuracy
- Digital and Analog versions
- Granite bases available in other sizes for custom requirements