ULTRASPEC-III
3 Wavelength Laser Illuminator
Quote
- Improved imaging and contrast
- Three laser lines can be used independently or blended – 670nm, 1064nm and 1300nm
- Suits most backside microscopes
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, probing, and most other backside techniques
Description
3 Wavelength Laser Illuminator
ULTRASPEC-III coherent laser illumination source is designed to meet the needs of today’s photoemission microscopes as well as backside imaging stations.
In standard configuration with laser wavelengths at 670nm, 1064nm and 1300nm, you have the immediate flexibility to illuminate just the topside or silicon surface and then switch to 1064nm (or 1300nm if you have a longer wavelength sensitive camera) for crisp, high-contrast backside imaging. The system produces superior backside images through the silicon with phase-blended laser illumination.
You wouldn’t limit your microscope with improper optics, so why limit it with improper illumination?
In the image below, note how the monochromatic source brings out diffraction limited details in the backside image. ULTRASPEC-III gives no chromatic aberration and is also compatible with many oil immersion objectives.
ULTRASPEC-III is sold under license from Jim Colvin Consulting Services and is protected under US Patents – # 6112004 & 6134365
Related products
-
CTC Polisher
Low Volume Bench-top Fiber PolisherLearn More $4,023.00 Select options- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Low to Medium Volume polishing of Connectors, termini and contacts.
- Cost-Effective Polishing – The use of 2 inch films on the machine make it extremely cost-effective
-
ULTRACOLLIMATOR
Sample Parallelism Alignment With LASER PrecisionLearn More Quote Select options- Works in conjunction with tilt controls to control sample alignment
- Improves alignment accuracy up to 20X
- Suits topside & backside electronic sample polishing
- Suits requirements for double sided polishing
-
UT.MINIPOL.1 Single-Position Polisher
Single Position Fiber PolisherLearn More $3,448.00 – $4,598.00 Select options- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Wide range of holders
- Low Cost machinery solution
-
FTTx Polisher
Portable Fiber PolisherLearn More $4,023.00 – $5,748.00 Select options- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Use anywhere – true portable machine, with battery power
- Bench-top stand – converts polisher for small production use in the factory
Related products
-
Blue Mill
Milling, Chip-off and IC Pre-Cavitation MachineLearn More Quote Select options- Complete Solution – NO COMPUTER REQUIRED!
- No programming or ‘G-Coding’ experience required
- Great milling results for users of all experience levels
- Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
- Cold Chip-off for Digital Forensics of NAND Flash
- Extremely Compact Footprint
- For the budget conscious user who needs industry-proven results
-
ULTRAPOL Basic
Manual Lapping & Polishing MachineLearn More $3,958.00 Select options- Cost-effective manual polisher
- High Torque mechanism
- In-built coolant system
- Can be used with manual tools
- Upgradeable with Long Arm Positioner
- High Quality Build
-
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More Quote Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
-
ARC-lite
Antireflective Coating System For Backside AnalysisLearn More Quote Add to cart- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
