ULTRASPEC-III
3 Wavelength Laser Illuminator
Quote
- Improved imaging and contrast
- Three laser lines can be used independently or blended – 670nm, 1064nm and 1300nm
- Suits most backside microscopes
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, probing, and most other backside techniques
Description
3 Wavelength Laser Illuminator
ULTRASPEC-III coherent laser illumination source is designed to meet the needs of today’s photoemission microscopes as well as backside imaging stations.
In standard configuration with laser wavelengths at 670nm, 1064nm and 1300nm, you have the immediate flexibility to illuminate just the topside or silicon surface and then switch to 1064nm (or 1300nm if you have a longer wavelength sensitive camera) for crisp, high-contrast backside imaging. The system produces superior backside images through the silicon with phase-blended laser illumination.
You wouldn’t limit your microscope with improper optics, so why limit it with improper illumination?
In the image below, note how the monochromatic source brings out diffraction limited details in the backside image. ULTRASPEC-III gives no chromatic aberration and is also compatible with many oil immersion objectives.
ULTRASPEC-III is sold under license from Jim Colvin Consulting Services and is protected under US Patents – # 6112004 & 6134365
Related products
-
Height Indicators
Fast, Accurate Drop-Down Gauges- Choice of Accuracy
- Digital and Analog versions
- Granite bases available in other sizes for custom requirements
-
ULTRAPOL Basic Chip-Off Package
For Digital Forensics Chip-Off- Includes Polisher, Long Arm, Sample Holder and Consumables
- Produce Excellent results, independent of operator skill level
- Affordable for all sizes of Lab
- Industry-Standard Equipment
-
Blue Mill
Milling, Chip-off and IC Pre-Cavitation Machine- Complete Solution – NO COMPUTER REQUIRED!
- No programming or ‘G-Coding’ experience required
- Great milling results for users of all experience levels
- Built to last – heavy-duty solid steel welded cabinet – with powder coat finish
- Cold Chip-off for Digital Forensics of NAND Flash
- Extremely Compact Footprint
- For the budget conscious user who needs industry-proven results
-
ASAP-1®
Analog Selected Area Preparation System- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
Related products
-
ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample Preparation- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
-
ULTRASLICE Compact
Versatile Precision Saw for Small workspaces & small budgets- Versatility – The system handles samples of most shapes, sizes and orientations.
- Cutting Accuracy – precision lead screws on all feed directions
- Long Cuts & Dicing – A large work-table and ‘open’ system design allows for longitudinal sectioning and dicing
- Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – a wide range of diamond and abrasive blades is available.
-
Height Indicators
Fast, Accurate Drop-Down Gauges- Choice of Accuracy
- Digital and Analog versions
- Granite bases available in other sizes for custom requirements
-
ULTRAPOL Manual Station
For Convenient, Practical Polishing Lab Management- Low cost
- Provides a conveinent station for the workday’s polishing activities
- Films, fluids and surfaces can be kept moist overnight with the optional lid