UT.MINIPOL.1 Single-Position Polisher
Single Position Fiber Polisher
$3,448.00 – $4,598.00
- Retro-polishing – Bring already-installed connectors up to current industry requirements
- Wide range of holders
- Low Cost machinery solution
Description
Single Position Fiber Polisher
UT.MINIPOL.1 is a fiber polishing system designed for prototyping and small production.
All connector types may be prepared by the system, including SC, FC, ST, D4, SMA, Bare fiber, PC, and Flat polishes are all accommodated by simple changes of the lap and/or the workholder.
A factory-set reciprocating arm movement rides the rotating lap producing high performance. This produces quality results at a low price.
UT.MINIPOL.1 allows for use as a retro-polishing machine or as a quick factory-use system whether used singly, or in tandem with other units.
The system can be powered by 110 or 220 VAC converter or by a standard 12V battery. A wide variety of Workholders are available for extending the use of the system at any time.
Machine Specifications
Item | Description |
---|---|
Lap Diameter | 4inch OD |
Weight: | 2.2kg (5 lbs.) |
Power Supply: | 12V Converter |
Timer: | 10-120 Seconds |
1 Position Connector Holders
Order Code | Item |
---|---|
2803.5 | SMA (905) |
2803.6 | SMA (906) |
2804.1 | ST |
2805.1 | SC |
2805.8 | SC-APC |
2811.1 | Ferrule Only (2.5mm) |
2811.2 | Ferrule Only (1.25mm) |
2811.8 | Angled Ferrule Only (2.5mm) |
2811.9 | Angled Ferrule Only (1.25mm) |
2811.XX | Contact Holder Assembly (specify contact O.D. & type) |
2813.1 | MU |
2813.8 | MU-APC |
2814.1 | FC |
2814.8 | FC-APC |
2815.1 | LC |
2815.8 | LC-APC |
Machine Specifications
Item | Description |
---|---|
Lap Diameter | 4inch OD |
Weight: | 2.2kg (5 lbs.) |
Power Supply: | 12V Converter |
Timer: | 10-120 Seconds |
Related Consumables
-
Lapping & Polishing Films – 4 inch (102mm) diameter
Lapping Films For Use With UT.Minipol.1 And Other 4" machines- Premium Quality Lapping Films
- Wide range of films in diamond, aluminum oxide and silicon carbide
- Available without adhesive-backing (PSA)
DIAMOND 4” Plain-backed (15 pcs.)
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.4430.1 0.1 15 $117. M.4431.1 0.5 15 $117. M.4432.1 1 15 $117. M.4433.1 3 15 $117. M.4437.1 6 15 $117. M.4435.1 9 15 $117. M.4436.1 15 15 $117. M.4438.1 30 15 $120. SILICON CARBIDE 4” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.4421.1 1 100 $75. M.4422.1 3 100 $75. M.4423.1 5 100 $75. M.4424.1 9 100 $75. M.4425.1 12 100 $75. M.4426.1 16 100 $75. M.4428.1 30 100 $85. ALUMINUM OXIDE 4” Plain-backed
Order
No.Micron
SizePack
QtyPack
PriceAdd To Cart M.4411.1 0.3 100 $75. M.4429.1 0.5 100 $75. M.4412.1 1 100 $75. M.4414.1 3 100 $75. M.4415.1 5 100 $75. M.4416.1 9 100 $75. M.4417.1 12 100 $75. M.4418.1 16 100 $75. M.4420.1 30 100 $85. M.4450.1 ULTRAFILM B 100 $150. ULTRAPOL B
Order No. Micron Size Pack Price Add To Cart 1528.4 ULTRAPOL B suspension (4 oz. Bottle) $81 1528.9 ULTRAPOL B suspension (1 gallon) $945 4” FILM Packages
Order No. Micron Size Pack Price Add To Cart 4400.2 MULTIMODE Film Pkg.
15 pcs. 5um Silicon Carbide
15 pcs. 1um Diamond
15 pcs. ULTRAFILM B
1oz. Bottle ULTRAPOL B Sus.$198 4400.1 SINGLEMODE Film Pkg.
15 pcs. 9um Silicon Carbide
15 pcs. 6um Diamond
15 pcs. 3um Diamond
15 pcs. 1um Diamond
15 pcs. ULTRAFILM B
1oz. Bottle ULTRAPOL B Sus.$398 4400.3 BARE-FIBER Film Pkg.
5 pcs. of step 1.
5 pcs. of step 2.$78
-
ULTRAPOL B Suspension
Final Polish Solution- Used with ULTRAFILM B
- Combination of film and suspension achieves a deep shine
- Convenient to use
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3 Wavelength Laser Illuminator- Improved imaging and contrast
- Three laser lines can be used independently or blended – 670nm, 1064nm and 1300nm
- Suits most backside microscopes
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ULTRAPOL Advance
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- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
-
ULTRASLICE Macrotome
Low Cost Sectioning System For Mobile Chips, Devices & Industry Samples- Suits Low Budgets
- Manual Crank Table Feed, with motor option
- Z-Spindle Option adds easy ability to adapt to sample height
- Chip-Off for Digital Forensics
- Fish & Game Samples
- Industrial Samples
-
ULTRAPOL Fiberlab Module System
Optical Fiber Lensing Machine- Fast Load & Unload
- Fast, Effective Polishing
- Wide Angular Range
- Digital Angle Readout Option
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ULTRACOLLIMATOR
Sample Parallelism Alignment With LASER Precision- Works in conjunction with tilt controls to control sample alignment
- Improves alignment accuracy up to 20X
- Suits topside & backside electronic sample polishing
- Suits requirements for double sided polishing
-
ULTRAPOL Advance
Flat Lapping and Polishing Machine- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
-
ARC-lite
Antireflective Coating System For Backside Analysis- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
-
ULTRASPEC-III
3 Wavelength Laser Illuminator- Improved imaging and contrast
- Three laser lines can be used independently or blended – 670nm, 1064nm and 1300nm
- Suits most backside microscopes
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, probing, and most other backside techniques