XYBOVE Re-application Tool
$673.00
Re-mounting station for producing final polishing tips. The XYBOVE Re-Application Tool makes replacing polishing tips straightforward and rapid — especially on smaller 1mm and 2mm diameter tools.
- Make Replacement XYBOVE Tips when required
- Save $$$ on buying new tools
- Fast and Convenient to use, especially on small diameter tools
- Supplied with punches for 1mm, 2mm, 3mm and 5mm diameter tips
Specifications
XYBOVE RE-APPLICATION Tool. Supplied with 3 sheets of Xybove and tools for manufacture of 1mm, 2mm, 3mm and 5mm Xybove tips.
Related products
ARC-lite
Antireflective Coating System For Backside AnalysisLearn More QUOTE Add to cart- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
ASAP-1®
Analog Selected Area Preparation SystemLearn More QUOTE Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample PreparationLearn More QUOTE Select options- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More QUOTE Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
Related products
ASAP-1®
Analog Selected Area Preparation SystemLearn More QUOTE Select options- Suits most sizes of die
- Low damage patented floating-head polishing method allows for extremely thin samples
- Mechanical Decapsulation
- Intuitive and easy to use
- Enables layer by layer topside removal for de-processing
- Short set-up and process times
- Easy ‘on the fly’ tilt adjustment.
ASAP-1® IPS
Digital Selected Area Preparation SystemLearn More QUOTE Select options- Accurately decaps, thins & polishes
- die, package, wafer and board-level
- Live Process Video
- Touchscreen with physical joystick & encoders
- Full 100 x 100 mm Stage area
- X, Y and Z axes all have deep sub-micron accuracy
- Floating Head provides a true polishing action
ARC-lite
Antireflective Coating System For Backside AnalysisLearn More QUOTE Add to cart- Fast and convenient – 45 second process
- Up to 30% more transmitted photon efficiency
- Up to 60% improved contrast under NIR
- Inexpensive to own and operate
- Bench-top, quiet, room temp. process
- All package types and sizes
- RC can be done ‘in-house’ – NO BAKING
- Assists and optimizes emission microscopy, Laser, FIB, voltage, thermal, FMI, probing, and most other backside techniques
ASAP-1® IN SITU
5-Axis CNC Mill for Selected Area Sample PreparationLearn More QUOTE Select options- IN SITU RST Upgrade – No tilt/curve translation errors – single footprint solution
- Adaptive 3D Mesh & Curve Mapping
- Import Overlays – use X-RAY, C-SAM images to improve targeting
- Two RST Versions available- NIR (≥10 microns) and VIS (≥ 10 nm) for ultra-thinning
- High-Def Digital Cameras — all native 4K (UHD)
- Option for (up to) 32” Vision Monitor
- Program by Touch, Mouse/Keyboard or REMOTELY