Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies. ULTRA TEC has given particular attention to supplying products that span the wide application range, from systems for preparing silicon, gallium arsenide (GaAs) etc, nanotechnology, MEMS, and devices to supplying advanced flat lapping and precision sawing equipment for back lapping (or back grinding).
For single die and package-level preparation, ULTRA TEC offers a numbers of precision lapping and polishing machines and milling-based approaches which offer advanced functionality for working with package warpage and stress, and offer electronic end-pointing for removing a precise amount of material.
Our Solutions Include...
Our Decapsulation Products Include