Semiconductors
Semiconductors
Crystal materials used for their semiconductor and/or electro-optic properties have ever more demanding surface and dimensional requirements, to keep pace with the results required for advanced communications and computer technologies. ULTRA TEC has given particular attention to supplying products that span the wide application range, from systems for preparing silicon, gallium arsenide (GaAs) etc, nanotechnology, MEMS, and devices to supplying advanced flat lapping and precision sawing equipment for back lapping (or back grinding).
For single die and package-level preparation, ULTRA TEC offers a numbers of precision lapping and polishing machines and milling-based approaches which offer advanced functionality for working with package warpage and stress, and offer electronic end-pointing for removing a precise amount of material.
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Our Solutions Include...
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ULTRAPOL Advance
Flat Lapping and Polishing MachineLearn More Quote Select options- Better processing results – ULTRACOLLIMATOR option allows for improved parallelism, improving the overall flatness ‘sweet spot’ of the delayered surface
- Fast & repeatable alignment – precise 2-circle tilt-adjust, coupled with high quality linear bearings in the Z-axis, provide for repeatable optical alignment ‘to the die’
- Slurry polishing – A recirculating pump may be added, in addition to the standard water coolant system.
- Avoids cross-contamination – The unique slurry / drip tray concept allows convenient removal and cleaning
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ULTRAPOL End & Edge
Flat And Angled Preparation Of Optical, Electronic & Materialographic ComponentsLearn More Quote Select options- Fully Angle adjustable – produces specific wedge angles
- Quick Release Interface allow for fast and repeatable mounting and demounting.
- Holders available for most components
- Fast process times
- Low run-out lap for flat optical polishes
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ULTRASLICE
Versatile Precision Saw with Z-SpindleLearn More Quote Select options- Z-Spindle – Allows for cutting depth to be altered even during operation
- Versatility – The system may be readily converted to handle sample cutting requirements of most shapes, sizes and applications.
- Cutting Accuracy – The use of precision lead screws on all sample feeds means cuts may be positioned accurately
- Long Cuts & Dicing – The large work-table andl layout of the machine allows for long cuts to be achieved – perfect for failure analysis, and QA applications such as longitudinal sectioning of components. Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – The system accepts a wide range of O.D. diamond and abrasive blades for standard cutting, and is readily adaptable to accept special ‘dicing’ blades for the smallest kerf.
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ULTRASLICE Compact
Versatile Precision Saw for Small workspaces & small budgetsLearn More Quote Select options- Versatility – The system handles samples of most shapes, sizes and orientations.
- Cutting Accuracy – precision lead screws on all feed directions
- Long Cuts & Dicing – A large work-table and ‘open’ system design allows for longitudinal sectioning and dicing
- Sectioned workpieces may be an end in themselves, or the starting point for lapping and polishing
- Most Blade Types – a wide range of diamond and abrasive blades is available.
